Patents by Inventor Kunio Ikegaya

Kunio Ikegaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed circuit board and process for producing and using the same
    Patent number: 5981041
    Abstract: A multilayer printed circuit board is obtained by impregnating a base material with a thermosetting resin in to form a prepreg; applying an undercoating agent comprising a terminal-bifunctional linear epoxy resin having an average epoxy equivalent of 450 to 6,000, together with at least one of 2-undecylimidazole, 1-cyanoethy1-2-undecylimidazole or 2,4-diamino-6{2'-undecyl-imidazole(1')}ethyl-s-triazine, or the aforementioned components together with an aromatic polyamine, to at least one circuit side of an interlayer circuit board on at least one side of which a circuit has been formed; and laying the prepreg on at least one side of the undercoating agent-applied interlayer circuit board and subjecting them to laminating.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: November 9, 1999
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Kunio Ikegaya, Shigeru Egusa, Yoshiyuki Takahashi