Patents by Inventor Kunio Koizumi

Kunio Koizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor pressure sensor having a recess with a larger area than a planar shape of a diaphragm
    Patent number: 8567255
    Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: October 29, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventors: Daigo Aoki, Hideyuki Hashimoto, Tetsuya Kobayashi, Kunio Koizumi, Yoshiaki Shimizu, Yutaka Takashima, Shinya Yokoyama
  • SEMICONDUCTOR PRESSURE SENSOR
    Publication number: 20110214505
    Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.
    Type: Application
    Filed: May 17, 2011
    Publication date: September 8, 2011
    Inventors: Daigo Aoki, Hideyuki Hashimoto, Tetsuya Kobayashi, Kunio Koizumi, Yoshiaki Shimizu, Yutaka Takashima, Shinya Yokoyama
  • Thin-film magnetic head controlling floating amount by locally projecting element portion toward recording medium by thermal expansion and method of manufacturing the same
    Patent number: 7894160
    Abstract: A thin-film magnetic head which can locally project a reproduction element toward a recording medium and a method of manufacturing the thin-film magnetic head are provided. The thin-film magnetic head includes a reproduction element, a recording element which is stacked on the reproduction element and has a pair of magnetic core layers and a coil layer configured to apply a recording magnetic field to the magnetic core layers, and a heat-emitting member emitting heat by electrification, which causes the reproduction element to project toward the recording medium by thermal expansion. The heat-emitting member is disposed below the coil layer.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: February 22, 2011
    Assignee: TDK Corporation
    Inventors: Kiyoshi Kobayashi, Kunio Koizumi, Kenji Ichinohe
  • THIN-FILM MAGNETIC HEAD CONTROLLING FLOATING AMOUNT BY LOCALLY PROJECTING ELEMENT PORTION TOWARD RECORDING MEDIUM BY THERMAL EXPANSION AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20070211381
    Abstract: A thin-film magnetic head which can locally project a reproduction element toward a recording medium and a method of manufacturing the thin-film magnetic head are provided. The thin-film magnetic head includes a reproduction element, a recording element which is stacked on the reproduction element and has a pair of magnetic core layers and a coil layer configured to apply a recording magnetic field to the magnetic core layers, and a heat-emitting member emitting heat by electrification, which causes the reproduction element to project toward the recording medium by thermal expansion. The heat-emitting member is disposed below the coil layer.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 13, 2007
    Applicant: ALPS ELECTRONIC CO. , LTD
    Inventors: Kiyoshi Kobayashi, Kunio Koizumi, Kenji Ichinohe