Abstract: An object is to provide a PTC element capable of preventing lead terminals from delaminating from an element body. This PTC element 1 is a PTC element comprising an element body 10 in which an electroconductive filler is dispersed in a crystalline polymer, and a pair of terminal electrodes 12, 14 thermocompression-bonded with the element body 10 in between, wherein each of the pair of terminal electrodes 12, 14 has an overlapping region 121, 141 overlapping with the element body 10, and a nonoverlapping region 122, 142 not overlapping with the element body 10, and wherein the nonoverlapping region 122, 142 of each of the pair of terminal electrodes 12, 14 is constructed of a succession of a wide portion 122a a width of which is large across a direction in which the terminal electrode 12, 14 extends from the element body 10, and a narrow portion 122b a width of which is smaller than the width of the wide portion 122a.

Abstract: An object is to provide a PTC element capable of preventing lead terminals from delaminating from an element body. This PTC element 1 is a PTC element comprising an element body 10 in which an electroconductive filler is dispersed in a crystalline polymer, and a pair of terminal electrodes 12, 14 thermocompression-bonded with the element body 10 in between, wherein each of the pair of terminal electrodes 12, 14 has an overlapping region 121, 141 overlapping with the element body 10, and a nonoverlapping region 122, 142 not overlapping with the element body 10, and wherein the nonoverlapping region 122, 142 of each of the pair of terminal electrodes 12, 14 is constructed of a succession of a wide portion 122a a width of which is large across a direction in which the terminal electrode 12, 14 extends from the element body 10, and a narrow portion 122b a width of which is smaller than the width of the wide portion 122a.

Abstract: A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.

Abstract: Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at

Abstract: An electronic component feed system capable of feeding an electronic component mounting apparatus with a variety of electronic components such as chips, lead-type electronic components and the like in various forms. A plurality of feeder modules corresponding to sorts of electronic components to be mounted on printed circuit boards are stored in a storage kit and transferred through the storage kit to an electronic component feed section of the mounting apparatus on which a printed circuit board is held. Then, the electronic components are mounted on the printed circuit board by means of a mounting head.

Abstract: A screen printing method includes the steps of moving a doctor plate across a printing screen to apply a paste thereon and then moving a squeegee across the screen to deposit a paste on an object below the screen while maintaining a predetermined pressure of the screen against the object to produce a substantially even deposition of the paste. The method also can include varying the squeegee pressure as the screen tension varies to maintain the predetermined printing pressure and using a screen aligning mark on an imaging plane to correct the positional relationship between the screen and the object.

Abstract: A screen printing apparatus capable of uniformly applying a paste onto a screen to accomplish fining of a printed pattern and formation of a fined printed pattern. The apparatus includes a pair of laterally movable printing heads alternately actuated for printing and each including a doctor plate and a squeegee which are vertically movably arranged. The doctor plates of the printing heads being arranged laterally opposite to each other on the screen. The doctor plates each serve to apply a paste onto the screen while transferring the paste on the screen and the squeegees each act ot press the screen against a printed object after application of the paste onto the screen by the doctor plate corresponding thereto.