Patents by Inventor Kunio Mori

Kunio Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210326828
    Abstract: A weighing and pricing device includes: a processor that executes a registration process for a product to be purchased by a customer; a transceiver that: establishes a connection between a mobile device possessed by the customer and the weighing and pricing device; and upon establishing the connection, receives, from the mobile device, identification information that identifies the mobile device; and a storage that stores information relating to the product and the identification information in association with each other. After the registration process is interrupted, the transceiver receives, from the mobile device, identification information. The processor specifies the product associated with the stored identification information that corresponds to the identification information received after the registration process. The processor recommences the registration process for the specified product.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Teraoka Seiko Co., Ltd.
    Inventors: Eriko Enatsu, Tomoki Kaneko, Naoto Kurosaki, Kazuya Sasaki, Shingo Higuchi, Kunio Mori, Kazuki Watanabe
  • Publication number: 20210138763
    Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Masami SAITO, Koji KONDO, Masashi TOTOKAWA, Hirotaka MIYANO, Yoshitake SUGANUMA, Kenichi YAGI, Yuichi KATO, Kunio MORI, Katsuhito MORI, Taiga HANDA
  • Publication number: 20200064287
    Abstract: A measurement device for estimating thermal characteristics includes a heat generating source unit that has heat sensors for detecting heat radiating toward a measurement sample unit, and that heats the measurement sample unit, the measurement sample unit, and a heat cooling source unit that has heat sensors for detecting heat radiating from the measurement sample unit, and that cools the measurement sample unit, wherein those units are sequentially stacked, the measurement sample unit has a three-layer structure consisting of an object to be measured for estimating thermal characteristics, and heat conducting materials that sandwich the object, the heat conducting materials are adhered to the heat generating source unit and the heat cooling source unit one another through a heat-transfer promoting agent therebetween, the object to be measured for estimating thermal characteristics and the heat conducting materials are adhered to one another through physical contact, chemical contact, and/or chemical bond con
    Type: Application
    Filed: December 12, 2017
    Publication date: February 27, 2020
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, SULFUR CHEMICAL LABORATORY INC.
    Inventors: Kunio MORI, Takeshi BESSHO, Nobumasa KIMURA
  • Patent number: 10385076
    Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: August 20, 2019
    Assignees: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Publication number: 20170334933
    Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 23, 2017
    Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shuukichi TAKII, Shigeru MICHIWAKI, Manabu MIYAWAKI, Masanori YANAI, Kouichi KAMIYAMA, Hitomi CHIBA, Yasuyuki MASUDA
  • Patent number: 9790242
    Abstract: A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: the compound (?) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3?n, or —N{Rb—Si(Rc)n(ORd)3?n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: October 17, 2017
    Assignees: Sulfur Chemical Laboratory, Inc.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Patent number: 9593423
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: March 14, 2017
    Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Patent number: 9540403
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 10, 2017
    Assignees: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
  • Publication number: 20160152641
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 2, 2016
    Applicants: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO
  • Patent number: 9238757
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: January 19, 2016
    Assignees: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
  • Publication number: 20150152124
    Abstract: Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: said compound (?) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 4, 2015
    Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Publication number: 20140227539
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Application
    Filed: March 18, 2014
    Publication date: August 14, 2014
    Applicants: Kunio Mori, Sulfur Chemical Institute Incorporated, MEIKO ELECTRONICS CO., LTD.
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shigeru MICHIWAKI, Manabu MIYAWAKI
  • Patent number: 8753748
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: June 17, 2014
    Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Publication number: 20130183534
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 18, 2013
    Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Publication number: 20130177770
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Application
    Filed: September 28, 2011
    Publication date: July 11, 2013
    Applicants: Sulfur Chemical Institute Incorporated, Kunio Mori
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
  • Publication number: 20120028042
    Abstract: A base material for adhesion to be adhered to a solid body includes a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.
    Type: Application
    Filed: October 5, 2011
    Publication date: February 2, 2012
    Applicant: ASAHI RUBBER INC.
    Inventors: Kunio MORI, Kazuhisa TAKAGI
  • Patent number: 8062466
    Abstract: A base material for adhesion to be adhered to a solid body comprising; a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: November 22, 2011
    Assignee: Asahi Rubber Inc.
    Inventors: Kunio Mori, Kazuhisa Takagi
  • Patent number: 8006901
    Abstract: A mobile terminal is provided. A scanner unit reads code information attached to a commodity. A RAM stores the code information read by the scanner unit as commodity-for-purchase information. The scanner unit, to confirm whether the commodity-for-purchase information stored in the RAM is correct, the scanner unit reads the code information of one part of the commodity-for-purchase. A CPU switches from reading for storage to reading for confirmation. It is determined whether information contained in the code information read by the scanner unit is stored in the RAM. A display displays a result of the determination.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: August 30, 2011
    Assignee: Teraoka Seiko Co., Ltd.
    Inventors: Naokazu Sato, Naofumi Narita, Kunio Mori
  • Publication number: 20110171480
    Abstract: A simple silicone-rubber bonded object is provided in which non-flowable substrates, i.e., a three-dimensional silicone rubber elastic substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other without using a flowable curable adhesive or pressure-sensitive adhesive and which is inexpensive and has high productivity. The silicone-rubber bonded object comprises a three-dimensional silicone rubber elastic substrate having hydroxyl groups on the surface and an adherend substrate having hydroxyl groups on the surface, the substrates having been laminated to each other through covalent bonding between the hydroxyl groups of both. The elastic substrate and/or the adherend substrate has undergone corona discharge treatment and/or plasma treatment, whereby the hydroxyl groups have been formed on the surface thereof.
    Type: Application
    Filed: September 15, 2009
    Publication date: July 14, 2011
    Applicants: ASAHI RUBBER INC., SULFUR CHEMICAL INSTITUTE INC.
    Inventors: Kunio Mori, Kazuhisa Takagi
  • Publication number: 20110104505
    Abstract: Provided is a laminated body which solves, all at once, the issues of conventional methods, such as adhesiveness to a board having low surface roughness, stress concentration relaxing, reliability improvement, high adhesiveness (especially, that of a conductor layer), heat resistance, almighty characteristics (being adherable irrespective of the type of an adhesive), in manufacture of laminated bodies. The laminated body is formed by having an entropically elastic molecular adhesive layer between two boards, and the entropically elastic molecular adhesive layer is composed of an entropically elastic material layer, and a layer of a molecular adhesive having a group which can be bonded to the entropically elastic material layer.
    Type: Application
    Filed: June 4, 2009
    Publication date: May 5, 2011
    Inventors: Kunio Mori, Yusuke Matsuno