Abstract: An object of the present invention is to provide a thermal recording material which is excellent in all of the following characteristics: plasticizer resistance, image stability against moisture and heat, the resistance to background fogging under moisture and heat, and the retention of color developing ability. Provided is a thermal recording material having, on a paper support, a heat-sensitive recording layer containing a colorless or light-colored dye precursor and a developer which reacts with the dye precursor on heating and converts the dye precursor to its colored form, the paper support containing 0.25 to 1.0% by mass of a neutral rosin sizing agent relative to the pulp solid content in combination with calcium carbonate and aluminum sulfate, the developer having a phenylureido moiety in its molecule.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece and a base. The piezoelectric vibrating piece includes an excitation portion, a framing portion, a connecting portion, excitation electrodes, and extraction electrodes. The base includes a mounting terminal, a cutout portion formed on a side surface, and a cutout-portion electrode formed in the cutout portion. The cutout-portion electrode connects the mounting terminal to the extraction electrode. The extraction electrode includes a cutout-portion region connected to the cutout-portion electrode, an excitation-electrode connecting region connected to the excitation electrode, and an erosion preventing region disposed between the cutout-portion region and the excitation-electrode connecting region to prevent erosion by solder.

Abstract: An object of the present invention is to provide a thermal recording material which is excellent in all of the following characteristics: plasticizer resistance, image stability against moisture and heat, the resistance to background fogging under moisture and heat, and the retention of color developing ability. Provided is a thermal recording material having, on a paper support, a heat-sensitive recording layer containing a colorless or light-colored dye precursor and a developer which reacts with the dye precursor on heating and converts the dye precursor to its colored form, the paper support containing 0.25 to 1.0% by mass of a neutral rosin sizing agent relative to the pulp solid content in combination with calcium carbonate and aluminum sulfate, the developer having a phenylureido moiety in its molecule.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece and a base. The piezoelectric vibrating piece includes an excitation portion, a framing portion, a connecting portion, excitation electrodes, and extraction electrodes. The base includes a mounting terminal, a cutout portion formed on a side surface, and a cutout-portion electrode formed in the cutout portion. The cutout-portion electrode connects the mounting terminal to the extraction electrode. The extraction electrode includes a cutout-portion region connected to the cutout-portion electrode, an excitation-electrode connecting region connected to the excitation electrode, and an erosion preventing region disposed between the cutout-portion region and the excitation-electrode connecting region to prevent erosion by solder.

Abstract: A piezoelectric device, in which one of a first plate, a second plate, and an adhesive agent is colored for confirming a bonding status of the adhesive agent, and a manufacturing method thereof, are provided. A piezoelectric device includes a piezoelectric vibrating piece that vibrates by applying a voltage; a first plate and a second plate formed of glass and seal the piezoelectric vibrating piece; and an adhesive agent which bonds the first plate with the second plate, wherein one of the first plate, the second plate, and the adhesive agent is colored.

Abstract: A piezoelectric vibrating piece includes a vibrating portion, a framing portion, and a connecting portion. The framing portion surrounds the vibrating portion. The connecting portion connects the vibrating portion and the framing portion. The connecting portion includes an inclined surface disposed on at least one of a front surface and a back surface of the connecting portion. A boundary between the inclined surface and a flat surface is established in a middle region that is away from a connecting region of the connecting portion and the vibrating portion, and is away from a connecting region of the connecting portion and the framing portion.

Abstract: AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z?-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the ?Z?-edge of the vibrating portion. The first through-slot has a different width than the second through-slot.

Abstract: Methods are disclosed for manufacturing piezoelectric vibrating devices that do not acquire unwanted gas or water vapor inside their respective packages during manufacture and that attain such end by methods suitable for mass-production. An exemplary manufacturing method includes preparing a piezoelectric wafer having multiple piezoelectric frames; on the piezoelectric wafer defining at least one first through-hole per frame; preparing a base wafer having multiple package bases alignable with the frames; on the base wafer defining at least one second through-hole; preparing a lid wafer having multiple package lids alignable with the frames; applying a sealing material between a first main surface of each frame and an inner main surface of the base wafer, and between a second main surface of each frame and an inner main surface of the lid wafer; and thereby bonding the three wafers together to form multiple packaged piezoelectric devices.

Abstract: A piezoelectric device, in which one of a first plate, a second plate, and an adhesive agent is colored for confirming a bonding status of the adhesive agent, and a manufacturing method thereof, are provided. A piezoelectric device includes a piezoelectric vibrating piece that vibrates by applying a voltage; a first plate and a second plate formed of glass and seal the piezoelectric vibrating piece; and an adhesive agent which bonds the first plate with the second plate, wherein one of the first plate, the second plate, and the adhesive agent is colored.

Abstract: AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z?-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the ?Z?-edge of the vibrating portion. The first through-slot has a different width than the second through-slot.

Abstract: Methods are disclosed for manufacturing piezoelectric vibrating devices that do not acquire unwanted gas or water vapor inside their respective packages during manufacture and that attain such end by methods suitable for mass-production. An exemplary manufacturing method includes preparing a piezoelectric wafer having multiple piezoelectric frames; on the piezoelectric wafer defining at least one first through-hole per frame; preparing a base wafer having multiple package bases alignable with the frames; on the base wafer defining at least one second through-hole; preparing a lid wafer having multiple package lids alignable with the frames; applying a sealing material between a first main surface of each frame and an inner main surface of the base wafer, and between a second main surface of each frame and an inner main surface of the lid wafer; and thereby bonding the three wafers together to form multiple packaged piezoelectric devices.