Patents by Inventor Kunio Nakaniwa

Kunio Nakaniwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090321268
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: February 13, 2007
    Publication date: December 31, 2009
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa
  • Publication number: 20060099443
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: January 14, 2004
    Publication date: May 11, 2006
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa