Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: An electric-component mounting system for mounting a plurality of electric components onto a circuit board. The system includes a plurality of electric-component mounting units which are arranged in a predetermined direction with a spacing distance between each adjacent pair of the electric-component mounting units. Each of the electric-component mounting units includes (a) a board holding device which is capable of holding the circuit board in a predetermined position, (b) a component mounting device which is capable of mounting the electric components onto the circuit board held by the board holding device, and (c) a component supplying device which is capable of supplying the electric components to the component mounting device. The system further includes a spacing-distance changing device capable of changing the spacing distance.

Abstract: A nozzle-mounting device for removably mounting, on a nozzle holder, a suction nozzle for holding an electric component by suction, wherein the nozzle holder includes one of a first fitting portion and a second fitting portion which respectively have an inner circumferential surface and an outer circumferential surface and which are arranged to effect a fitting engagement with each other at the inner and outer circumferential surfaces, while the suction nozzle includes the other of the first and second fitting portions, and one of the first and second fitting portions is provided with a first abutting portion located at an axially intermediate portion of mutually fitting parts of the inner and outer circumferential surfaces, while the other of the first and second fitting portions is provided with a second abutting portion arranged to be brought into abutting contact with the first abutting portion in a direction intersecting the axes of the fitting portions, and wherein a pressing device is provided to force

Abstract: An electric-component mounting system for mounting a plurality of electric components onto a circuit board. The system includes a plurality of electric-component mounting units which are arranged in a predetermined direction with a spacing distance between each adjacent pair of the electric-component mounting units. Each of the electric-component mounting units includes (a) a board holding device which is capable of holding the circuit board in a predetermined position, (b) a component mounting device which is capable of mounting the electric components onto the circuit board held by the board holding deice, and (c) a component supplying device which is capable of supplying the electric components to the component mounting device. The system further includes a spacing-distance changing device capable of changing the spacing distance.

Abstract: A method and device for feeding an electronic component are provided by which extensive shutdown of the electronic component mounting device due to lack of components is prevented, thereby enhancing the operation rate. The device has a feeder section designating unit (32) for designating a desired one of feeder sections (22), and a feeder section controller (31) for forcibly moving the feeder section which is currently feeding electronic components to a retracted position when the other feeder section has been designated by the feeder section designating unit (32) and for moving the designated feeder section which has been in a standby state to a predetermined component feeding position, by which a long-time pause of the electronic component mounting device caused by exhaustion of components is prevented and the operation rate is enhanced.

Abstract: A nozzle-mounting device for removably mounting, on a nozzle holder, a suction nozzle for holding an electric component by suction, wherein the nozzle holder includes one of a first fitting portion and a second fitting portion which respectively have an inner circumferential surface and an outer circumferential surface and which are arranged to effect a fitting engagement with each other at the inner and outer circumferential surfaces, while the suction nozzle includes the other of the first and second fitting portions, and one of the first and second fitting portions is provided with a first abutting portion located at an axially intermediate portion of mutually fitting parts of the inner and outer circumferential surfaces, while the other of the first and second fitting portions is provided with a second abutting portion arranged to be brought into abutting contact with the first abutting portion in a direction intersecting the axes of the fitting portions, and wherein a pressing device is provided to force

Abstract: An object supplying apparatus, including a housing, pulleys which are rotatable about respective substantially horizontal axis lines and at least one of which is provided in the housing, a conveyor belt which has a plurality of pockets provided in a surface thereof and arranged in a lengthwise direction thereof, and which is wound on the pulleys such that a portion of the belt extends in a substantially horizontal direction and the pockets provided in the portion of the belt open upward, a circulative lifter which is circulated on a substantially vertical plane in the housing, and which has at least one holder which holds at least one of a plurality of objects present in a lower portion of the housing, conveys the object upward, and releases the object at an object-release position in the housing, a guide device which is provided below the object-release position and which guides the object toward the portion of the conveyor belt, and a clearing device which clears, from the portion of the conveyor belt, the

Abstract: A method of causing a wound-on member to contact a printed wiring board and conveying the printed wiring board by utilizing a frictional force produced between the wound-on member and the printed wiring board, the method including the steps of providing two conveying units each of which includes a wound-on member and two rotatable wheels on which the wound-on member is wound to have a straightly extending portion which straightly extends between the two rotatable wheels, such that the two conveying units are spaced from each other in a direction parallel to a printed wiring board, and such that the respective straightly extending portions of the two wound-on members of the two conveying units cooperate with each other to sandwich the printed wiring board in a direction substantially parallel to the printed wiring board, and conveying the printed wiring board by rotating the rotatable wheels of the two conveying units, and thereby moving the two wound-on members, while utilizing a frictional force produced bet

Abstract: A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load.

Abstract: A circuit component supplying system including a plurality of feeders each of which stores a plurality of circuit components of at least one sort and supplies the circuit components of the one sort, one by one, a feeder holder including a plurality of feeder holding portions which hold the plurality of feeders, respectively, and a managing device which manages the supplying of the circuit components by the each of the feeders, the each feeder including a code holder which holds at least a feeder identification code distinguishing the each feeder from the other feeders, and the managing device managing the supplying of the circuit components by the each feeder, based on the feeder identification code held by the code holder of the each feeder.

Abstract: An electronic-component ("EC") removing system including a supplying device which feeds an EC carrier tape in a feeding direction parallel to a length-wise direction of an adhesive tape of the carrier tape, a thrusting device including a thrust member and a first actuator which moves the thrust member between a thrusted and a retracted position through an opening of the adhesive tape in a thrusting direction perpendicular to the feeding direction, and a receiving device including a holder which holds each of ECs adhered to the adhesive tape, a movable member which supports the holder such that the holder is movable relative thereto, and a second actuator which moves the movable member between an EC removing position in which the holder is opposed via each EC to the thrust member and, when the thrust member is moved to the thrusted position through the opening of the adhesive tape to thrust each EC toward the holder, the holder is moved with each EC relative to the movable member in the thrusting direction to

Abstract: A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load.

Abstract: A transfer type circuit board fabricating system having a plurality of working modules each including (a) a conveyor device for transferring circuit boards in a predetermined transfer direction, (b) a working device for performing a predetermined operation on the circuit boards, and (c) a controller constituted principally by a computer, for controlling the working device, wherein the conveyor devices transfer the circuit boards one after another in the predetermined transfer direction through the working devices of the working modules, the system further having a coordinating control device constituted principally by a computer, for controlling the controllers of the working modules, on the basis of predetermined working schedule information stored therein, and status information which is received from the controllers of said working modules and which indicates operating states of the working modules.

Abstract: Method and apparatus for holding an electronic component prior to its placement on a circuit substrate. The component sucked by a sucker is first centered in one direction by closing movements of a first pair of opposed positioning members toward the component, and then centered in another direction normal to the above one direction by closing movements of a second pair of opposed positioning members which occur only after the first pair of positioning members are opened. The first pair of positioning members are provided on an assembly holding the sucker, and the second pair of positioning members are provided on the sucker holder assembly or separately from the sucker holder assembly. In the latter instance, the assembly holding the sucker and the first pair of positioning members are adapted to be movable relative to the separately provided second pair for alignment of the sucker with the separate second pair.

Abstract: A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components which are stored mutually independently within a multiplicity of apertures equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly consecutively. A plurality of the leading portions cut off the strip members respectively storing different kinds of components are arranged on a transfer element of a transfer assembly in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred and mounted on a printed circuit board one by one.

Abstract: A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components which are stored mutually independently within a multiplicity of apertures equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly consecutively. A plurality of the leading portions cut off the strip members respectively storing different kinds of components are arranged on a transfer element of a transfer assembly in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred, and mounted on a printed circuit board one by one.