Abstract: An electronic parts mounting apparatus for divisionally recognizing an electronic part (2) even when the apparatus is arranged in such that the relative positional relation between a recognition camera (4) and a nozzle (1) cannot be varied. The electronic part (2) is vacuum-clamped by a nozzle (1), the posture of the nozzle (1) or the posture of the electronic part (2) is changed a plurality of times by a rotary driving member (3), and a part of the electronic part (2) imaged by the recognition camera (4) every time the posture of the electronic part (2) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part (2) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

Abstract: It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening 14 provided in the nozzle tip end 13 for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end 13 by a specified amount, and the rotation amount of the nozzle tip end 13 and the positioning position of the part supply portion are controlled.

Abstract: The present invention concerns a method and apparatus of automatically mounting electronic components at predetermined positions of an electronic circuit board, which comprise a mounting process of taking out an electronic component 10 from an electronic components holding unit 6 and mounting onto an electronic circuit board 5 and a processing process to trim the electronic component 10 during the mounting process to a preferable characteristic value thereby allowing to reduce the number of types of electronic components 10 to be stored in the electronic components holding unit 6 and reduce the equipment cost and the management cost of the electronic components 10.

Abstract: An electronic component mounting apparatus is provided with a plurality of support blocks for supporting boards. A support block is automatically selected from among the plurality of support blocks and exchanged in accordance with the switching of the kind of boards to be supported by the support block, so that the time required for switching the kind of boards is reduced, thereby improving the productivity.

Abstract: An electronic component mounting apparatus is provided with a plurality of support blocks for supporting boards. A support block is automatically selected from among the plurality of support blocks and exchanged in accordance with the switching of the kind of boards to be supported by the support block, so that the time required for switching the kind of boards is reduced, thereby improving the productivity.

Abstract: The invention presents an electronic part mounting method capable of appropriately shortening the mounting cycle depending on the situation of the rotary head.

Abstract: In a method and an apparatus for mounting of electronic components onto a board, there are provided a head section (35) having a plurality of nozzles (12, 13) for sucking electronic components and a recognition camera (15) for recognizing a posture of a sucked electronic component through its image. A controller (1) is provided for controlling the head section so that after the electronic components at a component feed section (30) are sucked by the nozzles, the sucked posture is image-recognized by the recognition camera and corrected.

Abstract: An electronic component mounting apparatus is provided with a plurality of support blocks for supporting boards. A support block is automatically selected from among the plurality of support blocks and exchanged in accordance with the switching of the kind of boards to be supported by the support block, so that the time required for switching the kind of boards is reduced, thereby improving the productivity.