Patents by Inventor Kunio Oshimo

Kunio Oshimo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode illumination circuit, illumination device, and liquid crystal display apparatus
    Patent number: 7884553
    Abstract: A light-emitting diode illumination circuit includes light-emitting diodes connected in series and compensating elements connected in parallel with the light-emitting diodes. Each of the compensating elements includes positive and negative terminals and at least one conductor having a predetermined melting point. The conductor melts in the event of open-circuit failure so that the terminals are connected.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: February 8, 2011
    Assignee: Sony Corporation
    Inventors: Haruaki Wada, Kunio Oshimo, Takenobu Urazono
  • LIGHT-EMITTING DIODE ILLUMINATION CIRCUIT, ILLUMINATION DEVICE, AND LIQID CRYSTAL DISPLAY APPARATUS
    Publication number: 20080106205
    Abstract: A light-emitting diode illumination circuit includes light-emitting diodes connected in series and compensating elements connected in parallel with the light-emitting diodes. Each of the compensating elements includes positive and negative terminals and at least one conductor having a predetermined melting point. The conductor melts in the event of open-circuit failure so that the terminals are connected.
    Type: Application
    Filed: May 16, 2007
    Publication date: May 8, 2008
    Applicant: SONY CORPORATION
    Inventors: Haruaki Wada, Kunio Oshimo, Takenobu Urazono
  • Electronic circuit device
    Publication number: 20030012005
    Abstract: According to an electronic circuit device, when a circuit board having electrical parts mounted thereon is sealed with resin, the heat and pressure of the resin is prevented from acting on the electrical parts thus mounted. A circuit board (10) having electrical parts (11) and an IC (12) mounted thereon is accommodated in a sleeve formed of a thermal-shrinkage film (16), and subjected to thermal shrinkage to intermediate-package the circuit board. Thereafter, the overall body thereof is molded with a resin (17) and the circuit board (10) is sealed.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 16, 2003
    Inventors: Yoshinori Ito, Kunio Oshimo, Mikito Imai, Hiroshi Ozaki