Abstract: A method for cutting workpiece made of such a glass or ceramic material having relatively large thickness. A workpiece having one surface on which an incision is previously formed is placed on a flat plate which has a Young's modulus smaller than that of the workpiece and which is placed on a surface plate, so that the surface having the incision of the workpiece faces the upper surface of the flat plate. A pressing load is then applied downwardly through a pressing member to the surface opposite to the surface having the incision of the workpiece locally along the incision. The workpiece is thus cut by the bending moment due to the difference of the Young's moduli of the workpiece and the flat plate without generating noises or forming chips.

Abstract: An apparatus for cutting a workpiece of glass, ceramic, or like material on a surface of which an incised cutting line has been formed beforehand has a backing roller made of an acrylic resin on which the workpiece is laid so that the incised line is in contact with the backing roller, a pressure applying roller with an annular pressure applying rim around its outer cylindrical surface for applying localized pressing force on the surface of the workpiece directly opposite the incised line, and a feeding mechanism for feeding the workpiece, thus pressed between the pressure applying rim and the backing roller, in the direction of the incised line, whereby the localized pressing force is applied over the entire length of the incised line. The localized pressing force creates a bending moment in the workpiece, producing a tension stress which becomes a maximum along the incised line, whereby the workpiece fractures and is thereby cut along the section in which incised line lies.