Patents by Inventor Kunio Sakauchi

Kunio Sakauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ethylene-alpha-olefin copolymer, resin composition containing same and biaxially stretched film thereof
    Publication number: 20060089477
    Abstract: An ethylene-?-olefin copolymer resin having a melt index of 0.5 to 2.0 g/l0 minutes and a density of 0.905 to 0.920 g/cm3 and showing such a temperature raising elution fractionation pattern that the amount of fractions corresponding to a high density polyethylene is 8 to 25% of the total elution and that the amount of fractions eluted up to a temperature of T40° C. is 40% of the total elution and the amount of fractions eluted up to a temperature of T70° C. is 70% of the total elution, wherein the value of 30/(T70?T40) is 2.0 to 3.3% ° C.
    Type: Application
    Filed: August 12, 2005
    Publication date: April 27, 2006
    Applicant: OKURA INDUSTRIAL CO., LTD.
    Inventors: Toshitaka Kanai, Shin-ichiro Miyazaki, Hideki Uehara, Kunio Sakauchi, Toshiro Yamada
  • Ethylene-alpha-olefin copolymer, resin composition containing same and biaxially stretched film thereof
    Publication number: 20040220367
    Abstract: An ethylene-&agr;-olefin copolymer resin having a melt index of 0.5 to 2.0 g/10 minutes and a density of 0.905 to 0.920 g/cm3 and showing such a temperature raising elution fractionation pattern that the amount of fractions corresponding to a high density polyethylene is 8 to 25% of the total elution and that the amount of fractions eluted up to a temperature of T40° C. is 40% of the total elution and the amount of fractions eluted up to a temperature of T70° C. is 70% of the total elution, wherein the value of 30/(T70−T40) is 2.0 to 3.3%/° C.
    Type: Application
    Filed: February 4, 2004
    Publication date: November 4, 2004
    Inventors: Toshitaka Kanai, Shin-ichiro Miyazaki, Hideki Uehara, Kunio Sakauchi, Toshiro Yamada
  • Heat shrinkable, coextruded polyethylene film laminate
    Patent number: 6509087
    Abstract: A heat shrinkable, coextruded polyethylene film laminate having two surface layers, and an intermediate layer interposed therebetween, wherein each of the surface layers comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm3 and a linear high density polyethylene having a density of 0.925-0.945 g/cm3 and wherein the intermediate layer comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm3 and a linear very low density polyethylene having a density of 0.880-0.915 g/cm3.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: January 21, 2003
    Assignee: Okura Industrial Co., Ltd.
    Inventors: Hideki Uehara, Yoshio Matsuda, Kunio Sakauchi
  • Heat shrinkable, coextruded polyethylene film laminate
    Publication number: 20020187360
    Abstract: A heat shrinkable, coextruded polyethylene film laminate having two surface layers, and an intermediate layer interposed therebetween, wherein each of the surface layers comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm3 and a linear high density polyethylene having a density of 0.925-0.945 g/cm3 and wherein the intermediate layer comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm3 and a linear very low density polyethylene having a density of 0.880-0.915 g/cm3.
    Type: Application
    Filed: May 2, 2001
    Publication date: December 12, 2002
    Applicant: OKURA INDUSTRIAL CO., LTD.
    Inventors: Hideki Uehara, Yoshio Matsuda, Kunio Sakauchi