Abstract: Although an Ag—CdO-based material has excellent electric properties such as deposition resistance, arc resistance and low contact resistance, which are required for an electric contact, the discharge standard provision in Japan, EC Directive on Waste from Electrical and Electronic Equipment (WEEE) and the like have been directed toward disuse of Cd, as already known. Thus, the present invention is characterized in that after an atmosphere in a pressured oxidation furnace is replaced with oxygen, the temperature of an internal-oxidative Ag alloy prepared under a condition of a cold roll rate of 50 to 95% is gradually raised from a temperature of 200° C. or less in a pressured oxygen atmosphere with an oxygen pressure of 5 to 50 kg/cm2 and internal oxidation processing is performed with an upper limit temperature of 700° C.

Abstract: Although an Ag—CdO-based material has excellent electric properties such as deposition resistance, arc resistance and low contact resistance, which are required for an electric contact, the discharge standard provision in Japan, EC Directive on Waste from Electrical and Electronic Equipment (WEEE) and the like have been directed toward disuse of Cd, as already known. Thus, the present invention is characterized in that after an atmosphere in a pressured oxidation furnace is replaced with oxygen, the temperature of an internal-oxidative Ag alloy prepared under a condition of a cold roll rate of 50 to 95% is gradually raised from a temperature of 200° C. or less in a pressured oxygen atmosphere with an oxygen pressure of 5 to 50 kg/cm2 and internal oxidation processing is performed with an upper limit temperature of 700° C.

Abstract: A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

Abstract: A solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Ag≦4.0; 0<Cu≦2.0; 0<Ni≦1.0; and 0<Ge≦1.0, wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film. Additionally, a solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Sb≦3.5; 0≦Ag ≦4.0; 0<Ge≦1.0; and at least one first additive selected from the group consisting of (a) 0<Ni≦1.0 and (b) a combination of 0<Ni≦1.0 and 0<Cu≦1.0; wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film.

Abstract: Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper.