Abstract: A semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules is provided. The semiconductor manufacturing apparatus comprises a scheduler for calculating a cycle time so that a difference in time required for each of the desired processes is within an allowable time range and generating a transfer plan for the plurality of substrates based on the cycle time, and a transfer controller for controlling the plurality of transfer modules so that the plurality of substrates are serially transferred to the process modules according to the generated transfer plan.

Abstract: A substrate processing system for performing processing on a plurality of substrates. The substrate processing system comprises: a processing unit comprising a plurality of processing modules each configured to perform a predetermined process; a transfer unit having a transfer device configured to transfer a substrate to each of the plurality of processing modules; a loading/unloading unit configured to hold a plurality of substrates and load/unload a substrate to/from the processing unit; and a controller configured to control the processing unit, the loading/unloading unit, and the transfer unit. The controller controls the transfer unit to transfer to the plurality of processing modules in a serial manner a plurality of substrates that are sequentially loaded from the loading/unloading unit to the processing unit, the controller further comprises a standby mode setting unit configured to set a standby period of the substrate at an appropriate timing depending on a content of the process.

Abstract: A semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules is provided. The semiconductor manufacturing apparatus comprises a scheduler for calculating a cycle time so that a difference in time required for each of the desired processes is within an allowable time range and generating a transfer plan for the plurality of substrates based on the cycle time, and a transfer controller for controlling the plurality of transfer modules so that the plurality of substrates are serially transferred to the process modules according to the generated transfer plan.

Abstract: A substrate processing system includes a processing section that includes a plurality of process modules each of which performs a predetermined processing; a carrying-in/out section that holds the plurality of substrates, and carries the substrates into/out of the processing section; a transfer unit that transfers the substrates; and a controller that controls the processing section, the carrying-in/out section, and the transfer unit. The controller performs a control such that the plurality of substrates is sequentially transferred from the carrying-in/out section to the processing section, and the transferred substrates are sequentially and serially transferred to the plurality of process modules, sets an interval until a next substrate is unloaded after a substrate is unloaded from a predetermined module of the carrying-in/out section, and performs a control such that the plurality of substrates is sequentially unloaded from the predetermined module with a setting value of the interval.

Abstract: A substrate processing system includes a processing unit including processing modules and a first transfer device, a loading/unloading unit including a load port holding a substrate accommodating container and a second transfer device, and a control unit. The control unit controls the substrates to be sequentially transferred.

Abstract: A substrate processing system includes a processing unit including processing modules and a first transfer device, a loading/unloading unit including a load port holding a substrate accommodating container and a second transfer device, and a control unit. The control unit controls the substrates to be sequentially transferred.

Abstract: A substrate processing system includes a processing section that includes a plurality of process modules each of which performs a predetermined processing; a carrying-in/out section that holds the plurality of substrates, and carries the substrates into/out of the processing section; a transfer unit that transfers the substrates; and a controller that controls the processing section, the carrying-in/out section, and the transfer unit. The controller performs a control such that the plurality of substrates is sequentially transferred from the carrying-in/out section to the processing section, and the transferred substrates are sequentially and serially transferred to the plurality of process modules, sets an interval until a next substrate is unloaded after a substrate is unloaded from a predetermined module of the carrying-in/out section, and performs a control such that the plurality of substrates is sequentially unloaded from the predetermined module with a setting value of the interval.

Abstract: A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

Abstract: The rolling element screw device includes: a screw shaft having a rolling element raceway groove; a nut member, which has a loaded rolling element raceway groove opposed to the rolling element raceway groove and is threadingly engaged with the screw shaft through intermediation of the rolling elements; and the circulation component, which includes a pair of the first circulating portions passing through a peripheral wall of the nut member, and the second circulating portion coupling the pair of first circulating portions together, to thereby form the endless circulation path for the rolling elements. Each of the first circulating portions includes a first cylindrical portion fitted into a circulation component mounting hole of the nut member, and a second cylindrical portion which has an outer diameter larger than an outer diameter of the first cylindrical portion. The first cylindrical portion includes a rolling element introducing hole.

Abstract: A microwave processing method for processing an object in a processing chamber is probided by using microwaves. The method includes loading the object into the processing chamber in a state where a pressure in the processing chamber is higher than that of an outside environment; discharging O2 gas from the processing chamber by introducing N2 gas into the processing chamber; performing heat treatment on the object by introducing microwaves into the processing chamber from which the O2 gas has been discharged; and cooling the object in a state where the pressure in the chamber is higher than that of the outside environment.

Abstract: The rolling element screw device includes: a screw shaft having a rolling element raceway groove; a nut member, which has a loaded rolling element raceway groove opposed to the rolling element raceway groove and is threadingly engaged with the screw shaft through intermediation of the rolling elements; and the circulation component, which includes a pair of the first circulating portions passing through a peripheral wall of the nut member, and the second circulating portion coupling the pair of first circulating portions together, to thereby form the endless circulation path for the rolling elements. Each of the first circulating portions includes a first cylindrical portion fitted into a circulation component mounting hole of the nut member, and a second cylindrical portion which has an outer diameter larger than an outer diameter of the first cylindrical portion. The first cylindrical portion includes a rolling element introducing hole.

Abstract: A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

Abstract: A substrate treatment apparatus eliminates breakage of a wafer W due to having the wafer supported by a supporting member when heat treatment is performed on the wafer W a plurality of times by a heat treatment module. The substrate processing apparatus includes a recipe setting unit for setting process conditions for a process recipe for the semiconductor wafer W and a direction of the semiconductor wafer W, by associating the conditions and the direction with each other. Through the recipe setting unit, the direction of the semiconductor wafer W can be set, and the semiconductor wafer W can be arranged in a direction set by an alignment module. Thus, portions R to be supported by the supporting members 60a, 60b and 60c on the rear surface of the semiconductor wafer can be changed every time the heat treatment module performs heat treatment.

Abstract: When a wafer (W101) to be returned from a second cluster (12) to a first cluster (10) is delivered to a pass area (PA), a vacuum transfer robot (RB1) in the first cluster (10) performs serial transportation in the first cluster (10) preferentially while keeping the wafer (W101) at the pass area (PA). Subsequently, the vacuum transfer robot (RB1), holding a wafer (W104) to be sent from the first cluster (10) to the second cluster (12) by one arm thereof, receives the wafer (W101) existing in the pass area (PA) by the other arm thereof and delivers the wafer (W104) to the pass area (PA) instead, through pick and place operation. According to the procedure, throughput of continuous processing employing a plurality of process modules of two clusters (multi-chamber apparatuses) (10, 12) is improves as much as possible.

Abstract: A method and apparatus for inputting stitch patterns by way of a digitizer is effective to record stitching patterns which involve skipping and which extend beyond the digitizer board. In a method aspect, where stitch patterns involve skipping and the drawings of the patterns exceed beyond the digitizer plotting board, a method is provided including the steps of commanding scale-down input coordinate values and converting the input coordinate values to scale-up values to recover the reduced value. In an apparatus aspect, an input device is provided comprising a digitizer for drawing stitching patterns, control circuitry for performing scaling function, and command generating circuitry for commencing the scaling activity.

Abstract: A sewing machine control apparatus is adapted to move a needle rod to a predetermined stitching starting point automatically when a stitching operation is performed, even if a fabric holding body holding an article to be stitched is displaced relative to the needle rod. The apparatus is equipped with operating means for generating a signal which displaces the fabric holding body in an X-Y direction, second control means responsive to the signal for controlling drive means to move the fabric holding body starting means for generating a signal which starts a driving source of the sewing machine, third control means for storing a signal indicative of the position of the fabric holding body while constantly revising the signal, and fourth control means for controlling the drive means in response to the start signal in such a manner that the fabric holding body is moved from any position to the stitching starting position.

Abstract: An input device for a sewing machine is partially provided in a portable unit connectable to a sewing machine. Efficiencies are achieved by relying on input portions present in the sewing machine. The portable input device includes control portions for inputting a stitch pattern, test running a stitch pattern, modifying a stitch pattern, writing a stitch pattern, and reading a stitch pattern. When the portable input device is coupled to the sewing machine, the stitch patterns may be executed.

Abstract: An input device for sewing machines comprising a means for making visible the sewing pattern up to the inflection point immediately followed by the inflection point to be modified to facilitate the modification of the sewing pattern, a means for inputting the coordinate data of the inflection point to be modified, a means for indicating the contents of the modification, and a means for operating the contents of the modification thus indicated under a predetermined control.

Abstract: A movement control apparatus for a sewing machine to automatically control movement initiating timing corresponding to various sewing machine speeds.

Abstract: An input device for sewing machines is disclosed which reads from a memory circuit an original sewing pattern which has been already stored, enlarging or reducing the coordinate data of the original sewing pattern in a desired scale, and prepare the coordinate data of sewing points between the flexing points thus obtained by enlargement or reduction in accordance with a desired stitch length data or stitch number data. The input device is adapted to convert the coordinate data of the original sewing pattern to the coordinate data calculated with the central point of a crank member of a work holder with the crank member as the origin and enlarge or reduce the coordinate data of the flexing points other than the starting point and the ending point of sewing in a desired scale, when the original sewing pattern is for a work holder with a crank member.