Patents by Inventor Kunio Yosihara

Kunio Yosihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4878098
    Abstract: A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.
    Type: Grant
    Filed: March 24, 1989
    Date of Patent: October 31, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tamio Saito, Kunio Yosihara