Patents by Inventor Kunitaka Kamishima

Kunitaka Kamishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor
    Patent number: 5336364
    Abstract: In manufacturing an insulation substrate used in a semiconductor device, a metal plate (10) having relatively thick body portions (11a,11b,11c) and relatively thin linkage portions (12,13) is prepared. The body portions are spaced from each other and the linkage portions link up the respective body portions. The metal plate is fixed to a metal flat plate (1) through a resin layer (2). The linkage portions are then removed through selective etching. The structure thus obtained is cut into a plurality of unit structures, to thereby obtain an in insulation substrate having conductive circuit patterns thereon.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: August 9, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shinobu Takahama, Kunitaka Kamishima
  • Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor
    Patent number: 5271993
    Abstract: In manufacturing an insulation substrate used in a semiconductor device, a metal plate (10) having relatively thick body portions (11a, 11b, 11c) and relatively thin linkage portions (12,13) is prepared. The body portions are spaced from each other and the linkage portions link up the respective body portions. The metal plate is fixed to a metal flat plate (1) through a resin layer (2). The linkage portions are then removed through selective etching. The structure thus obtained is cut into a plurality of unit structures, to thereby obtain an in insulation substrate having conductive circuit patterns thereon.
    Type: Grant
    Filed: July 23, 1991
    Date of Patent: December 21, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shinobu Takahama, Kunitaka Kamishima