Abstract: A semiconductor package includes a lead frame having an element mounting part and a lead part. A first semiconductor element and a second semiconductor element are sequentially stacked on a principal surface at least on one side of the element mounting part. An insulating resin layer serving as a second adhesive layer is filled between the first semiconductor element and the second semiconductor element. An element-side end portion of a first bonding wire connected to the first semiconductor element is buried in the insulating resin layer.

Abstract: A semiconductor package includes a circuit board having connection pads formed on a front and back surfaces, and a wiring network connected to these connection pads, as a package base. Metal bumps connected to at least part of the connection pads on the front and back surfaces via the wiring network are formed on the back surface of the circuit board as external connection terminals. One or a plurality of semiconductor elements electrically connected to the connection pad on the front surface side is or are mounted on a first element mounting part provided on the front surface side of the circuit board. One or plurality of semiconductor elements electrically connected to the connection pad on the back surface side is or are mounted on a second element mounting part provided on the back surface side of the circuit board.