Patents by Inventor Kun Mo Chu

Kun Mo Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite and Electronic Devices Including Liquid Metal Microparticles, and Method of Preparing Composite
    Publication number: 20260103602
    Abstract: Liquid metal microparticles, a method of preparing the liquid metal microparticles, a method of preparing a composite, a composite including liquid metal microparticles, and an electronic device including the liquid metal microparticles. The method of preparing liquid metal microparticles includes injecting liquid metal into a solvent using a syringe, where the syringe includes a piston and a nozzle, a diameter of the nozzle is less than or equal to about 30 micrometers, and an injection rate of the liquid metal with the syringe is greater than or equal to about 0.5 milliliters per minute, and the solvent includes a surfactant in an amount of greater than or equal to about 3 weight percent based on a total weight of the surfactant and the solvent, and the liquid metal and the solvent are each maintained at a temperature greater than or equal to a melting point of the liquid metal.
    Type: Application
    Filed: September 23, 2025
    Publication date: April 16, 2026
    Inventors: Cheonil PARK, Yuho WON, Kun Mo CHU, Sungjoon JOO
  • Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
    Patent number: 9516739
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: December 6, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
  • Heating composite, and heating apparatus and fusing apparatus including the same
    Patent number: 9348280
    Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Eui Lee, In-Taek Han, Yoon-Chul Son, Ha Jin Kim, Dong-Ouk Kim, Dong-Earn Kim, Kun Mo Chu
  • Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
    Patent number: 9000473
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
  • HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
    Publication number: 20150069455
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Application
    Filed: November 19, 2014
    Publication date: March 12, 2015
    Inventors: Eun Sung LEE, Sang Soo JEE, Kun Mo CHU, Se Yun KIM, Kyu Hyoung LEE, Sang Mock LEE
  • SURFACE COATING LAYER AND HEAT EXCHANGER INCLUDING THE SURFACE COATING LAYER
    Publication number: 20120181004
    Abstract: A surface coating layer, in contact with a surface of a base material of a heat exchanger, comprises a plurality of composite layers comprising a first layer contacting a surface of the base material, the first layer comprising a first matrix and a first nanobody, and a second layer contacting a surface of the first layer and having an interface with the air, where the first layer and the second layer each include a different amount by volume of the first nanobody and the second nanobody, respectively.
    Type: Application
    Filed: May 17, 2011
    Publication date: July 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon Chul SON, Sang Eui LEE, Ha Jin KIM, Dong Ouk KIM, Dong Earn KIM, Kun Mo CHU
  • HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
    Publication number: 20120056234
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Application
    Filed: August 19, 2011
    Publication date: March 8, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee