Patents by Inventor Kun-Peng Cheng

Kun-Peng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cover and method for manufacturing the same
    Publication number: 20070170621
    Abstract: The present invention discloses a cover including a base, a patterned layer, a protective layer and a bottom layer. The base has a first surface, and a second surface on the opposite side of the first surface. The patterned layer is formed on the first surface of the base. The protective layer and the bottom layer are integrally formed on the second surface of the base and on the patterned layer respectively by injection molding. The present invention also provides a method for manufacturing a cover. The present cover can tend give a various and vivid appearances whilst also having good performance.
    Type: Application
    Filed: September 13, 2006
    Publication date: July 26, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Jeng-Chi Peng, Wan-Te Huang, Zhi-Liang Mei, Kun-Peng Cheng, Qiang Liu, Zu-Lu Lin