Patents by Inventor Kunxia WEI

Kunxia WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12098452
    Abstract: A method for preparing a graphene/copper composite deformed copper-chromium-zirconium alloy layered strip is provided.
    Type: Grant
    Filed: April 7, 2024
    Date of Patent: September 24, 2024
    Assignee: CHANGZHOU UNIVERSITY
    Inventors: Wei Wei, Libo Yao, Kunxia Wei, Xulong An, Dandan Wang
  • Publication number: 20240254593
    Abstract: A method for preparing a graphene/copper composite deformed copper-chromium-zirconium alloy layered strip is provided.
    Type: Application
    Filed: April 7, 2024
    Publication date: August 1, 2024
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Wei WEI, Libo YAO, Kunxia WEI, Xulong AN, Dandan WANG
  • Patent number: 11834751
    Abstract: A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: December 5, 2023
    Assignee: CHANGZHOU UNIVERSITY
    Inventors: Wei Wei, Feilong Jia, Fuqiang Chu, Kunxia Wei, Qingbo Du, Jing Hu
  • Publication number: 20220162764
    Abstract: A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.
    Type: Application
    Filed: August 3, 2020
    Publication date: May 26, 2022
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Wei WEI, Feilong JIA, Fuqiang CHU, Kunxia WEI, Qingbo DU, Jing HU
  • Publication number: 20220042195
    Abstract: A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 10, 2022
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Wei WEI, Feilong JIA, Fuqiang CHU, Kunxia WEI, Qingbo DU, Jing HU