Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of conductive patterns and a plurality of interlayer insulating layers, which are alternately stacked on a substrate; a plurality of channel structures extending in a first direction substantially perpendicular to the substrate to penetrate the stack structure; at least one first slit extending in a second direction substantially horizontal to the substrate while penetrating conductive patterns for select lines among the plurality of conductive patterns; a second slit extending in the second direction while penetrating the conductive patterns for select lines; and a plurality of support structures disposed on a bottom of the second slit, the plurality of support structures penetrating conductive patterns for word lines among the plurality of conductive patterns.

Abstract: A pixel circuit includes: a capacitor; a switching transistor configured to be turned on in response to a scan signal applied through a scan line to transmit a data voltage applied through a data line to the capacitor; a signal delay compensation circuit including a compensation transistor configured to be turned on in response to the scan signal and a compensation capacitor, the signal delay compensation circuit being configured to compensate for a signal delay of the scan signal in response to a change in the data voltage; a driving transistor configured to generate a driving current based on the data voltage stored in the capacitor; and a light-emitting diode configured to operate based on the driving current to emit light.

Abstract: There are provided a semiconductor memory device and a manufacturing method of a semiconductor memory device. The semiconductor memory device may include a stack structure including a plurality of conductive layers, a hole formed in the stack structure, a memory layer allowing a first part and a second part of the hole to be spaced apart from each other in the hole, and a first channel layer disposed in the first part of the hole and a second channel layer disposed in the second part of the hole.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of conductive patterns and a plurality of interlayer insulating layers, which are alternately stacked on a substrate; a plurality of channel structures extending in a first direction substantially perpendicular to the substrate to penetrate the stack structure; at least one first slit extending in a second direction substantially horizontal to the substrate while penetrating conductive patterns for select lines among the plurality of conductive patterns; a second slit extending in the second direction while penetrating the conductive patterns for select lines; and a plurality of support structures disposed on a bottom of the second slit, the plurality of support structures penetrating conductive patterns for word lines among the plurality of conductive patterns.

Abstract: A display device and a method of driving the same are discussed. The display device can include a display panel including subpixels and a driver that drives the display panel. Each subpixel includes a light-emitting diode, a driving transistor, and a first switching transistor connected between a gate node and a drain node of the driving transistor. The first switching transistor includes a first A switching transistor and a first B switching transistor that operate in response to an Nth scan signal. Each subpixel further includes a second switching transistor connected between the gate node of the driving transistor and a first initialization voltage line, and a compensation transistor having a first electrode connected to a high-level voltage line and a second electrode connected to a connection point between the first A switching transistor and the first B switching transistor.

Abstract: Embodiments of the present invention provide a hybrid memory and a hybrid memory manufacturing method including both a volatile memory and a nonvolatile memory on a single substrate so as to increase an operation speed of a semiconductor device and reduce manufacturing cost. A hybrid memory includes: a substrate; a non-volatile memory including an alternating stack in which a plurality of insulation layers and a plurality of horizontal word lines are alternately stacked on the substrate; and a volatile memory including a capacitor, the capacitor penetrating through the alternating stack.

Abstract: Embodiments of the present invention provide a hybrid memory and a hybrid memory manufacturing method including both a volatile memory and a nonvolatile memory on a single substrate so as to increase an operation speed of a semiconductor device and reduce manufacturing cost. A hybrid memory includes: a substrate; a non-volatile memory including an alternating stack in which a plurality of insulation layers and a plurality of horizontal word lines are alternately stacked on the substrate; and a volatile memory including a capacitor, the capacitor penetrating through the alternating stack.

Abstract: A method for fabricating a semiconductor device includes: forming a mold stack layer including a mold layer and a supporter layer over a substrate; forming opening by etching the mold stack layer; selectively forming a supporter reinforcement layer on an exposed surface of the supporter layer which is positioned in the opening; forming a bottom electrode in the opening in which the supporter reinforcement layer is formed; and forming a supporter opening by etching a portion of the supporter layer to form a supporter that supports an outer wall of the bottom electrode.

Abstract: A method for fabricating a semiconductor device includes: forming a mold stack layer including a mold layer and a supporter layer over a substrate; forming opening by etching the mold stack layer; selectively forming a supporter reinforcement layer on an exposed surface of the supporter layer which is positioned in the opening; forming a bottom electrode in the opening in which the supporter reinforcement layer is formed; and forming a supporter opening by etching a portion of the supporter layer to form a supporter that supports an outer wall of the bottom electrode.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.

Abstract: A method and an apparatus for real-time analysis of the district heating network is disclosed. According to an embodiment of the present disclosure, a method for analyzing a district heating network including pipes and fluids inside the pipes includes receiving, by a processor, pipe data representing a structure of the pipes; receiving, by the processor, input data on at least one of the physical state of the district heating network and the flow of fluids; calculating, by the processor, data for at least one of the physical state of the district heating network or the flow of fluids using the pipe data and the input data.

Abstract: A semiconductor device includes a stacked structure including conductive layers and gaps respectively interposed between the conductive layers, a channel layer passing through the stacked structure, a ferroelectric layer surrounding a sidewall of the channel layer, and first dielectric patterns interposed between the ferroelectric layer and the conductive layers, respectively. The gaps extending between the first dielectric patterns.

Abstract: There are provided a semiconductor memory device and a manufacturing method of a semiconductor memory device. The semiconductor memory device may include a stack structure including a plurality of conductive layers, a hole formed in the stack structure, a memory layer allowing a first part and a second part of the hole to be spaced apart from each other in the hole, and a first channel layer disposed in the first part of the hole and a second channel layer disposed in the second part of the hole.

Abstract: A semiconductor device includes a stacked structure with conductive layers and insulating layers that are stacked alternately with each other, an insulating pillar passing through the stacked structure, a first channel pattern surrounding a sidewall of the insulating pillar, a second channel pattern surrounding the sidewall of the insulating pillar, a first insulator formed between the first channel pattern and the second channel pattern, and a memory layer surrounding the first channel pattern, the second channel pattern, and the first insulator, the memory layer with a first opening located that is between the first channel pattern and the second channel pattern.

Abstract: A semiconductor device includes a stacked structure including conductive layers and insulating layers stacked alternately with each other, a channel layer passing through the stacked structure, a ferroelectric layer surrounding a sidewall of the channel layer, a first dielectric layer surrounding a sidewall of the ferroelectric layer, and sacrificial patterns interposed between the first dielectric layer and the insulating layers and including a material with a higher dielectric constant than the first dielectric layer.

Abstract: A semiconductor memory device includes: a first gate stack structure including first interlayer insulating layers and first conductive layers, which are alternately stacked in a vertical direction; a dummy vertical channel penetrating the first gate stack structure; lower vertical channels penetrating the first gate stack structure at both sides of the dummy vertical channel; a second gate stack structure including second interlayer insulating layers and second conductive layers, which are alternately stacked in the vertical direction on the first gate stack structure; a first select line isolation structure partially penetrating the second gate stack structure; upper vertical channels connected to the lower vertical channels while penetrating the second gate stack structure; and a second select line isolation structure overlapping with the dummy vertical channel in the vertical direction, the second select line isolation structure penetrating a portion of the second gate stack structure.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of conductive patterns and a plurality of interlayer insulating layers, which are alternately stacked on a substrate; a plurality of channel structures extending in a first direction substantially perpendicular to the substrate to penetrate the stack structure; at least one first slit extending in a second direction substantially horizontal to the substrate while penetrating conductive patterns for select lines among the plurality of conductive patterns; a second slit extending in the second direction while penetrating the conductive patterns for select lines; and a plurality of support structures disposed on a bottom of the second slit, the plurality of support structures penetrating conductive patterns for word lines among the plurality of conductive patterns.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.

Abstract: A method and an apparatus for real-time analysis of the district heating network is disclosed. According to an embodiment of the present disclosure, a method for analyzing a district heating network including pipes and fluids inside the pipes includes receiving, by a processor, pipe data representing a structure of the pipes; receiving, by the processor, input data on at least one of the physical state of the district heating network and the flow of fluids; calculating, by the processor, data for at least one of the physical state of the district heating network or the flow of fluids using the pipe data and the input data.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.