Abstract: The present invention provides a display panel, including a display area, a binding area and a pad area located between the display area and the binding area. The display area is provided with a function layer, the binding area is provided with a driving unit, and the pad area provided with a plurality of pads arranged in multiple rows and multiple columns. One end of each of the pads is connected to the function layer, and the other end of each of the pads is connected to the driving unit, wherein the plurality of the pads are disposed asymmetrically with respect to the centerline, and the centerline is a centerline of the display panel running through the display area, the pad area, and the binding area.

Abstract: The present disclosure discloses a peripheral area part of a display panel including a chip connection area. The chip connection area includes at least two input signal connection pads and at least six output signal connection pads. The at least two input signal connection pads are arranged in an array along a first direction. The at least six output signal connection pads are arranged in three columns along a second direction. The at least six output signal connection pads are arranged in at least two rows along the first direction. The present disclosure can adapt to various types of chips.

Abstract: The present invention provides a display panel, including a display area, a binding area and a pad area located between the display area and the binding area. The display area is provided with a function layer, the binding area is provided with a driving unit, and the pad area provided with a plurality of pads arranged in multiple rows and multiple columns. One end of each of the pads is connected to the function layer, and the other end of each of the pads is connected to the driving unit, wherein the plurality of the pads are disposed asymmetrically with respect to the centerline, and the centerline is a centerline of the display panel running through the display area, the pad area, and the binding area.

Abstract: In an embodiment, the display light-on test device includes: a plurality of D-type connectors configured to be correspondingly connected to mobile phones with different connector types, and receive and transmit power signals; a sampling processor configured to receive the power signals, sample and quantize the power signals into digital data and/or image data, and output the data to a field programmable gate array chip, receive commands, and output, according to the commands, corresponding micro control commands; the field programmable gate array chip connected to the D-type connectors and the sampling processor, and configured to receive the data and the micro control commands, generate corresponding micro control parameters, and process, according to the micro control parameters, the data, to output data required to perform the light-on tests to the display modules to be tested, so that the light-on tests are performed on the display modules to be tested.

Abstract: Provided is an OLED device and a manufacturing method thereof. The OLED device includes: a flexible substrate having signal electrodes embedded on a surface of one side of the flexible substrate and a thin film transistor layer and a pixel unit layer prepared on a surface of the other side; both a first driving chip and a flexible circuit board are disposed on a back surface of the flexible substrate; signal traces in the thin film transistor layer and the pixel unit layer are connected to corresponding signal electrodes through vias, and the signal electrodes are connected to the first driving chip.

Abstract: In an embodiment, the display light-on test device includes: a plurality of D-type connectors configured to be correspondingly connected to mobile phones with different connector types, and receive and transmit power signals; a sampling processor configured to receive the power signals, sample and quantize the power signals into digital data and/or image data, and output the data to a field programmable gate array chip, receive commands, and output, according to the commands, corresponding micro control commands; the field programmable gate array chip connected to the D-type connectors and the sampling processor, and configured to receive the data and the micro control commands, generate corresponding micro control parameters, and process, according to the micro control parameters, the data, to output data required to perform the light-on tests to the display modules to be tested, so that the light-on tests are performed on the display modules to be tested.