Patents by Inventor Kunzhui LI

Kunzhui LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging CSP LED and CSP LED
    Patent number: 10573794
    Abstract: A method of packaging CSP LED, comprising the following steps: placing LED chips on a carrier plate; coating light-blocking glue or fluorescent glue on the LED chips; at last cutting to form CSP LEDs with coating light-blocking glue or fluorescent glue outside the chip. Multiple LEDs with one light-emitting surface could be fabricated simultaneously. The process is simple and can prevent yellow light from appearing at the bonding surface of the light-blocking glue and the chip. The invention provides a CPS LED with the chip covered by packaging glue and the electrode of the chip protruding exposed and protruding. The invention provides CPS LED with three light-emitting surfaces and light-blocking glue arranged on two side surfaces and fluorescent glue arranged on other surfaces. This kind of LED could be used in various fields such as backlight and light bar, from side surfaces of which light could be emitted.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 25, 2020
    Assignee: Hongli Zhihui Group Co.,Ltd.
    Inventors: Yi Xiong, Yuefei Wang, Tiangang Lv, Kunzhui Li, Guoping Li
  • METHOD OF PACKAGING CSP LED AND CSP LED
    Publication number: 20180277725
    Abstract: A method of packaging CSP LED, comprising the following steps: placing LED chips on a carrier plate; coating light-blocking glue or fluorescent glue on the LED chips; at last cutting to form CSP LEDs with coating light-blocking glue or fluorescent glue outside the chip. Multiple LEDs with one light-emitting surface could be fabricated simultaneously. The process is simple and can prevent yellow light from appearing at the bonding surface of the light-blocking glue and the chip. The invention provides a CPS LED with the chip covered by packaging glue and the electrode of the chip protruding exposed and protruding. The invention provides CPS LED with three light-emitting surfaces and light-blocking glue arranged on two side surfaces and fluorescent glue arranged on other surfaces. This kind of LED could be used in various fields such as backlight and light bar, from side surfaces of which light could be emitted.
    Type: Application
    Filed: March 31, 2016
    Publication date: September 27, 2018
    Applicant: Hongli Zhihui Group Co.,Ltd.
    Inventors: Yi XIONG, Yuefei WANG, Tiangang LV, Kunzhui LI, Guoping LI