Abstract: A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface upon being applied with a current, and the light guide lens is stacked on the light-emitting surface and used for emitting the light from a light guide surface of the light guide lens. The light guide surface has an annular ridge portion and a scatter region, such that the lights close to the central optical axis of the light-emitting surface (the region having the maximum light-emitting intensity) are deflected in a direction away from the central optical axis, and the lights far away from the central optical axis are deflected towards the central optical axis, so as to obtain a light with a uniform overall optical intensity.

Abstract: A lens and an LED using the lens to achieve homogeneous illumination include a region. The region around the optical axis of a lens is designed to be concave and form a divergent surface. The upper surface of the lens is a continuous curved surface to diverge the high-intensity light emitted by the LED in the vicinity of the optical axis through refractions. Therefore, the LED can homogeneously illuminate a larger area.

Abstract: A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.

Abstract: Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.

Abstract: Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.

Abstract: This invention discloses a resistance balance circuit including: at least two electronic components aligned in a row matrix, connected to one another in parallel, thereby forming a row matrix structure; an input end disposed at one end of the row matrix structure and configured for entry of current passing the electronic components in the row matrix structure; and an output end disposed diagonally opposite to the input end in the row matrix structure and configured for exit of the current passing the electronic components in the row matrix structure, wherein routes for the current passing the electronic components from the input end to the output end are equal in length, and thus the same current passes the electronic components in the matrix structure.

Abstract: A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface upon being applied with a current, and the light guide lens is stacked on the light-emitting surface and used for emitting the light from a light guide surface of the light guide lens. The light guide surface has an annular ridge portion and a scatter region, such that the lights close to the central optical axis of the light-emitting surface (the region having the maximum light-emitting intensity) are deflected in a direction away from the central optical axis, and the lights far away from the central optical axis are deflected towards the central optical axis, so as to obtain a light with a uniform overall optical intensity.

Abstract: A lead frame of a through-hole light emitting diode (LED) is used to carry an LED chip, and a lens is used to package the chip and a portion of the lead frame. The lead frame includes at least two leads. One lead is used to carry the chip and each of the leads is extended outward from the lens and has a positioning bump. The positioning bumps partially protrude from the lens, such that when the lead frame is disposed on a circuit board, the lead frame is positioned through the positioning bumps and aligns the lens to guide an optical axis of the through-hole LED, thereby achieving the purposes of convenient assembly, thinness, and a reduced thermal-conducting distance.

Abstract: A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.

Abstract: A lens and an LED using the lens to achieve homogeneous illumination include a region. The region around the optical axis of a lens is designed to be concave and form a divergent surface. The upper surface of the lens is a continuous curved surface to diverge the high-intensity light emitted by the LED in the vicinity of the optical axis through refractions. Therefore, the LED can homogeneously illuminate a larger area.