Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: Provided are an organometallic complex coating solution and a near-infrared absorption film, including an organometallic complex, a phosphorus-containing dispersant, and optical resin. The present disclosure greatly reduces the temperature and time of the film-forming process by formulating components of the organometallic complex coating solution.

Abstract: An anti-static resinous composition with permanent anti-static property is provided. The anti-static resinous composition comprises from 5 to 50 percent by weight of hydrophilic copolymer and from 50 to 95 percent by weight of thermoplastic. The hydrophilic copolymer is formed by self-emulsion polymerization. The monomer mixture used in the reaction comprises from 10 to 70 percent by weight of vinyl or propenyl macromonomer containing a polyethylene oxide chain and from 30 to 90 percent by weight of ordinary vinyl monomer. The thermoplastic is compatible with the hydrophilic copolymer. The resultant resinous composition has permanent anti-static properties.