Patents by Inventor Kuo-Cheng Liu
Kuo-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240136346Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.Type: ApplicationFiled: April 17, 2023Publication date: April 25, 2024Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
-
Publication number: 20240096882Abstract: A semiconductor structures and a method for forming the same are provided. The semiconductor structure includes first nanostructures and second nanostructures spaced apart from the first nanostructures in a first direction. A left-most point of the first nanostructures and a left-most point of the second nanostructures has a first distance in the first direction. The semiconductor structure further includes first source/drain features attached to opposite sides of the first nanostructures in a second direction being orthogonal to the first direction and third nanostructures and fourth nanostructures spaced apart from the third nanostructures in the first direction. A left-most point of the third nanostructures and a left-most point of the fourth nanostructures has a second distance in the first direction. In addition, the third nanostructures are wider than the first nanostructures in the first direction, and the first distance is smaller than the second distance.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsiao-Han LIU, Chih-Hao WANG, Kuo-Cheng CHIANG, Shi-Ning JU, Kuan-Lun CHENG
-
Publication number: 20240088026Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.Type: ApplicationFiled: January 17, 2023Publication date: March 14, 2024Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
-
Patent number: 9634436Abstract: An electrical connector includes an insulative housing, a number of first contact modules, a number of second contact modules and a number of third contacts all assembled into the insulative housing. Each first contact module includes a first wafer and first contacts insert-molded in the first wafer. Each second contact module includes a second wafer and second contacts insert-molded in the second wafer. The first contact modules, the second contact modules and the third contacts are arranged side by side after being inserted into the insulative housing. The adjacent first wafer and the second wafer cooperatively include mutual locking structures so that they can be inserted into the insulative housing in turn under a predetermined sequence.Type: GrantFiled: May 28, 2014Date of Patent: April 25, 2017Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I Yu, I-Hung Cheng, Kuo-Cheng Liu
-
Patent number: 9263815Abstract: A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing.Type: GrantFiled: August 27, 2012Date of Patent: February 16, 2016Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I Yu, Hung-Chi Tai, An-Yu Yu, Yung-Chih Hung, Jie-Jun Zeng, Kuo-Cheng Liu
-
Patent number: 9214762Abstract: A connector includes a housing, a mounting block assembled to the housing and a first contact inserted into the mounting block and the housing. The housing includes a receiving space and a first through hole in communication with the receiving space. The mounting block is assembled in the receiving space and includes a second through hole which is aligned with the first through hole. The first contact is inserted into the second through hole and the first through hole in sequence along a rear-to-front direction. The first contact includes an elastic member and the housing and/or the mounting block comprise a stop surface to resist against the elastic member for position restriction.Type: GrantFiled: May 21, 2014Date of Patent: December 15, 2015Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I Yu, Hung-Chi Tai, Kuo-Cheng Liu
-
Patent number: 9136625Abstract: A connector assembly includes a plug connector and a receptacle connector mateable with each other. The plug connector includes a plug insulative housing and a pair of plug power contacts. The plug insulative housing includes a first plug cavity, a first plate cantileveredly extending into the first plug cavity, and upper and lower plug contact slots in communication with the first plug cavity. The pair of plug power contacts are respectively received in the upper and lower plug contact slots. Each plug power contact includes a flat contacting section exposed to the first plug cavity and a first soldering section. The flat contacting sections are positioned on upper and lower surfaces of the first plate, respectively. The plug connector and the receptacle connector define heat dissipation channels in communication with each other in order that generating heat can be effectively dissipated to the air.Type: GrantFiled: October 28, 2013Date of Patent: September 15, 2015Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I Yu, Hung-Chi Tai, Yung-Chih Hung, Kuo-Cheng Liu
-
Publication number: 20150249296Abstract: An electrical connector includes an insulative housing, a number of first contact modules, a number of second contact modules and a number of third contacts all assembled into the insulative housing. Each first contact module includes a first wafer and first contacts insert-molded in the first wafer. Each second contact module includes a second wafer and second contacts insert-molded in the second wafer. The first contact modules, the second contact modules and the third contacts are arranged side by side after being inserted into the insulative housing. The adjacent first wafer and the second wafer cooperatively include mutual locking structures so that they can be inserted into the insulative housing in turn under a predetermined sequence.Type: ApplicationFiled: May 28, 2014Publication date: September 3, 2015Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I YU, I-Hung CHENG, Kuo-Cheng LIU
-
Publication number: 20150249301Abstract: A connector includes a housing, a mounting block assembled to the housing and a first contact inserted into the mounting block and the housing. The housing includes a receiving space and a first through hole in communication with the receiving space. The mounting block is assembled in the receiving space and includes a second through hole which is aligned with the first through hole. The first contact is inserted into the second through hole and the first through hole in sequence along a rear-to-front direction. The first contact includes an elastic member and the housing and/or the mounting block comprise a stop surface to resist against the elastic member for position restriction.Type: ApplicationFiled: May 21, 2014Publication date: September 3, 2015Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I YU, Hung-Chi TAI, Kuo-Cheng LIU
-
Publication number: 20150017830Abstract: A connector assembly includes a plug connector and a receptacle connector mateable with each other. The plug connector includes a plug insulative housing and a pair of plug power contacts. The plug insulative housing includes a first plug cavity, a first plate cantileveredly extending into the first plug cavity, and upper and lower plug contact slots in communication with the first plug cavity. The pair of plug power contacts are respectively received in the upper and lower plug contact slots. Each plug power contact includes a flat contacting section exposed to the first plug cavity and a first soldering section. The flat contacting sections are positioned on upper and lower surfaces of the first plate, respectively. The plug connector and the receptacle connector define heat dissipation channels in communication with each other in order that generating heat can be effectively dissipated to the air.Type: ApplicationFiled: October 28, 2013Publication date: January 15, 2015Applicant: ALLTOP ELECTRONICS (SUZHOU) CO., LTDInventors: Wang-I YU, Hung-Chi TAI, Yung-Chih HUNG, Kuo-Cheng LIU
-
Patent number: 8932082Abstract: An electrical connector mountable on a printed circuit board includes an insulative housing and pairs of power contacts. Each power contact has a contacting portion, a tail portion and an intermediate portion interconnecting the contacting portion and the tail portion. The intermediate portion is provided with a retention element in a rear edge thereof extending towards an inside wall of a passageway defined through the insulative housing. Each inside wall of the passageway forms a bump thereon extending along an insertion direction of a complementary connector. The retention element rides on the bump to thereby prevent an involuntarily anti-clockwise movement of the insulative housing with respect to the printed circuit board.Type: GrantFiled: January 25, 2013Date of Patent: January 13, 2015Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Hung-Chi Tai, Yung-Chih Hung, Kuo-Cheng Liu
-
Publication number: 20140357098Abstract: An electrical connector assembly includes an insulative housing, a number of contacts, a least a first PCB electrically connecting with the contacts, a pair of restriction sections, and a pair of fastening elements. The insulative housing comprises an upper wall, a lower wall opposite to the upper wall, and a pair of sidewalls connecting with the upper and lower walls. The contacts are received in the insulative housing. The first PCB comprises a pair of side sections partially surrounding the insulative housing. The pair of restriction sections is connected with the sidewalls of the insulative housing and partially overlaps with side sections of the first PCB. The pair of fastening elements respectively passes through the restriction sections and the side sections of the first PCB to align and position the relative position between the insulative housing and the first PCB for achieving more reliably electrical connection between the first PCB and the contacts.Type: ApplicationFiled: August 30, 2013Publication date: December 4, 2014Applicant: ALLTOP ELECTRONICS (SUZHOU), LTD.Inventors: Wang-I YU, Shi-Ke XIE, Kuo-Cheng LIU
-
Publication number: 20140127945Abstract: An electrical connector mountable on a printed circuit board includes an insulative housing and pairs of power contacts. Each power contact has a contacting portion, a tail portion and an intermediate portion interconnecting the contacting portion and the tail portion. The intermediate portion is provided with a retention element in a rear edge thereof extending towards an inside wall of a passageway defined through the insulative housing. Each inside wall of the passageway forms a bump thereon extending along an insertion direction of a complementary connector. The retention element rides on the bump to thereby prevent an involuntarily anti-clockwise movement of the insulative housing with respect to the printed circuit board.Type: ApplicationFiled: January 25, 2013Publication date: May 8, 2014Applicant: ALLTOP ELECTRONICS (SUZHOU), LTDInventors: Wang-I YU, Hung-Chi TAI, Yung-Chih HUNG, Kuo-Cheng LIU
-
Patent number: 8684772Abstract: An electrical connector includes an insulating housing having a number of passageways and a number of dividing walls extending from a rear side of the passageways; and a number of contact modules received in the insulating housing and arranged along a first direction. Each contact module includes an insulator and a number of conductive contacts received in the insulator. Each insulator includes a first section and a second section. The dimension of the first section along the first direction is larger than the dimension of the second section. When the contact modules are assembled to the insulating housing, the second sections are received in corresponding dividing walls, respectively.Type: GrantFiled: February 15, 2012Date of Patent: April 1, 2014Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Kuo-Cheng Liu, Zi-Yun Xia
-
Publication number: 20130344747Abstract: A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing.Type: ApplicationFiled: August 27, 2012Publication date: December 26, 2013Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I YU, Hung-Chi TAI, An-Yu YU, Yung-Chih HUNG, Jie-Jun ZENG, Kuo-Cheng LIU
-
Patent number: 8545270Abstract: An electrical connector for connecting a cable includes an insulating housing with power contacts and signal contacts received therein, and a power bus bar connecting with one power contact. The insulating housing includes a mating face, a mounting face opposite to the mating face and defines first and second passageways extending therethrough. Each power contact forms a first engaging portion and a first contacting portion. Each signal contact forms a second engaging portion and a second contacting portion. The power bus bar has a main section extending along a first plane, a middle section extending from the main section, and a connecting section extending along a second plane perpendicular to the first plane.Type: GrantFiled: January 4, 2012Date of Patent: October 1, 2013Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Hung-Chi Tai, Kuo-Cheng Liu, Hai-Lang Wang
-
Patent number: 8535067Abstract: A power connector mounting on a printed circuit board (PCB), includes an insulating housing, a number of power contacts received in the housing and a pair of spacers attached to the insulating housing. The insulating housing extends along a transversal direction and defines a number of passageways extending therethrough along a front-to-back direction. The insulating housing has a front wall, an opposite rear wall, a pair of side walls and a bottom wall with the passageway extending through the front wall and the rear wall. The spacer is assembled to the pairs of power contacts with locking members thereon for holding the power contacts in positions with respect to the insulating housing.Type: GrantFiled: December 14, 2011Date of Patent: September 17, 2013Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Kuo-Cheng Liu
-
Publication number: 20130164998Abstract: An electrical connector includes an insulating housing having a number of passageways and a number of dividing walls extending from a rear side of the passageways; and a number of contact modules received in the insulating housing and arranged along a first direction. Each contact module includes an insulator and a number of conductive contacts received in the insulator. Each insulator includes a first section and a second section. The dimension of the first section along the first direction is larger than the dimension of the second section. When the contact modules are assembled to the insulating housing, the second sections are received in corresponding dividing walls, respectively.Type: ApplicationFiled: February 15, 2012Publication date: June 27, 2013Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I YU, Kuo-Cheng LIU, Zi-Yun XIA
-
Patent number: D689438Type: GrantFiled: December 19, 2011Date of Patent: September 10, 2013Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Kuo-Cheng Liu
-
Patent number: D689439Type: GrantFiled: December 19, 2011Date of Patent: September 10, 2013Assignee: Alltop Electronics (Suzhou) Ltd.Inventors: Wang-I Yu, Kuo-Cheng Liu