Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: For producing chip or fiber boards or like articles by bonding particulate lignocellulosic material like chips or fibers with tannin-based adhesives like tannin resins or tannin containing resins, the lignocellulosic material is pre-hydrolyzed by means of adding acids, acidic salts or other acid liberating chemical compounds prior to adding a particular composition of adhesive material.

Abstract: A low cost method of binding lignocellulosic materials utilizing ammonium based spent sulfite liquor alone as the binder. Hot pressing a mat comprising lignocellulosic material and ammonium spent sulfite liquor at a temperature above 170.degree. C. decomposes the spent sulfite liquor. The decomposition products subsequently condense and polymerize in the presence of lignocellulosic materials to produce a composite product. An exterior grade board can be produced under certain operating conditions. Utilizing the lower molecular weight fraction of the liquor provides a more efficient binder.

Abstract: A method of making a thermosetting binder for lignocellulosic materials, utilizing spent sulfite liquor, and a method of making a particleboard product. Spent sulfite liquor treated with sufficient sulfuric acid to provide a lignosulfonic acid content of not less than 0.8 milliequivalent weight of NaOH per gram of spent sulfite liquor solids, makes it possible to make particleboard with press time and physical properties comparable to phenol or urea formaldehyde bonded boards but at considerably reduced material cost.