Patents by Inventor Kuo-Chi Hsu
Kuo-Chi Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240297138Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.Type: ApplicationFiled: May 13, 2024Publication date: September 5, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hung CHEN, Yu-Nu HSU, Chun-Chen LIU, Heng-Chi HUANG, Chien-Chen LI, Shih-Yen CHEN, Cheng-Nan HSIEH, Kuo-Chio LIU, Chen-Shien CHEN, Chin-Yu KU, Te-Hsun PANG, Yuan-Feng WU, Sen-Chi CHIANG
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Patent number: 12074206Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.Type: GrantFiled: August 30, 2021Date of Patent: August 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Wei Chen, Chih-Yu Hsu, Hui-Chi Chen, Shan-Mei Liao, Jian-Hao Chen, Cheng-Hao Hou, Huang-Chin Chen, Cheng Hong Yang, Shih-Hao Lin, Tsung-Da Lin, Da-Yuan Lee, Kuo-Feng Yu, Feng-Cheng Yang, Chi On Chui, Yen-Ming Chen
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Patent number: 12057486Abstract: The present disclosure provides a semiconductor device and a method of forming the same. The semiconductor device includes a first channel members being vertically stacked, a second channel members being vertically stacked, an n-type work function layer wrapping around each of the first channel members, a first p-type work function layer over the n-type work function layer and wrapping around each of the first channel members, a second p-type work function layer wrapping around each of the second channel members, a third p-type work function layer over the second p-type work function layer and wrapping around each of the second channel members, and a gate cap layer over a top surface of the first p-type work function layer and a top surface of the third p-type work function layer such that the gate cap layer electrically couples the first p-type work function layer and the third p-type work function layer.Type: GrantFiled: March 13, 2023Date of Patent: August 6, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Wei Chen, Wei Cheng Hsu, Hui-Chi Chen, Jian-Hao Chen, Kuo-Feng Yu, Shih-Hang Chiu, Wei-Cheng Wang, Yen-Ju Chen
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Patent number: 12041760Abstract: A transistor includes a gate structure that has a first gate dielectric layer and a second gate dielectric layer. The first gate dielectric layer is disposed over the substrate. The first gate dielectric layer contains a first type of dielectric material that has a first dielectric constant. The second gate dielectric layer is disposed over the first gate dielectric layer. The second gate dielectric layer contains a second type of dielectric material that has a second dielectric constant. The second dielectric constant is greater than the first dielectric constant. The first dielectric constant and the second dielectric constant are each greater than a dielectric constant of silicon oxide.Type: GrantFiled: August 9, 2022Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Yu-Chia Liang, Shih-Hao Lin, Kuei-Lun Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
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Publication number: 20160151088Abstract: A safety protective needle cover for butterfly needle assembly is disclosed. After the covering member is pivoted toward the base, the base may be covered by an accommodating space defined by the backs of the two pivoting walls and the concave cover such that the covering member and the base are parallel with each other. The needle will not be shifted due to the shake of the patient or being hooked by dress. After the covering member is pivoted toward the vertical portion of the L-shaped needle, the vertical portion of the L-shaped needle may be covered by the concave cover to prevent nursing staff or users from being stuck.Type: ApplicationFiled: December 2, 2014Publication date: June 2, 2016Inventors: KUO-CHI HSU, CHENG- KUO CHUANG, MIN-SUNG LAI
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Publication number: 20140366148Abstract: By disabling at least one data transmission port of a media access device when the media access device is connected to a storage medium under an encrypted state and when the media access device is capable of performing decryption corresponding to an encryption mechanism applied on the storage medium, data security of the storage medium can be secured.Type: ApplicationFiled: June 10, 2013Publication date: December 11, 2014Inventors: Tsang-Yi Chen, Kuo-Chi Hsu
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Patent number: 8808239Abstract: A syringe includes a needle, a barrel and a push rod inserted in the barrel. The needle includes a needle seat, a stop ring fitted on an outer wall of the needle seat, and a check groove formed on the inner wall of the needle seat. The check groove is adapted to engage with a check rib on a core post of the push rod. A resilient plug is provided in the barrel. The resilient plug has a central through hole for insertion of the core post of a push head of the push rod. The push rod has a frangible point at a front end thereof. When the push rod is pulled backward, the needle is received in the barrel completely and the rear section of the push rod can be broken.Type: GrantFiled: November 3, 2013Date of Patent: August 19, 2014Inventor: Kuo-Chi Hsu
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Publication number: 20140058325Abstract: A syringe includes a needle, a barrel and a push rod inserted in the barrel. The needle includes a needle seat, a stop ring fitted on an outer wall of the needle seat, and a check groove formed on the inner wall of the needle seat. The check groove is adapted to engage with a check rib on a core post of the push rod. A resilient plug is provided in the barrel. The resilient plug has a central through hole for insertion of the core post of a push head of the push rod. The push rod has a frangible point at a front end thereof. When the push rod is pulled backward, the needle is received in the barrel completely and the rear section of the push rod can be broken.Type: ApplicationFiled: November 3, 2013Publication date: February 27, 2014Inventor: KUO-CHI HSU
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Patent number: 6093170Abstract: An improved structure safety syringe comprised of a barrel having two trapezoidal-shaped tabs, a sleeve with a guide slot and, furthermore, limit slots extending from the circumferential surface at the two ends of the guide slot and an insertion section is formed at the inside end of the limit slot, wherein utilizing the engagement of the tabs and the insertion section enables the positioning of the barrel and the sleeve, and a plunger having a protective cap at the force application end that can be broken off at an appropriate time. When the protective cap is broken off and, furthermore, inserted into the other end of the sleeve, the objective of positioning is achieved and, furthermore, ensures that the hypodermic needle is not exposed.Type: GrantFiled: September 23, 1999Date of Patent: July 25, 2000Inventors: Kuo-Chi Hsu, Deng-Tzong Lin