Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: An optical fiber joint for inserting into an optical fiber connecting seat includes an optical fiber conduction wire, an octagonal plug and an optical fiber holding body; the octagonal plug has an insertion portion with wall planes in the shapes of octagonal rectangles; an optical fiber receiving body with a hollowed center is disposed at a distal end of the insertion portion; the optical fiber holding body is located at the central hollow area of the optical fiber receiving body; the optical fiber conduction wire penetrates the circular hole of the optical fiber holding body so as to form an optical fiber joint not limited in the upper and lower directions.

Abstract: A jack plug of digital connector includes a jack plug with an optical fiber cable. The device is characterized in that the jack plug is composed of a front plug and a tail plug. A plug hole is disposed at the back part of the front plug. The tail plug has an insertion hole and on the front part of the tail plug possesses two clips at upper and bottom side respectively. The optical fiber cable picks through the insertion hole of the tail plug and then insert the tail plug into the plug hole of the front plug so as to make the two clips of the tail plug hold the optical fiber cable and fixed them at the back end of the front plug.