Patents by Inventor Kuo-chih Huang

Kuo-chih Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250234476
    Abstract: A tool-free unlocking device includes a frame with an opening; an unlatching member movably connected to the frame; and a locking member having a first section fixed on the frame and a second section extending from first section and corresponding to the opening. Thus, when the unlatching member is not pushed, the end surface of the second section of the locking member abuts to form a locked state, or when the unlatching member is pushed from the first section of the locking member to the second section of the locking member, the second section of the locking member will be pushed down to the opening of the frame to form an unlocked state.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 17, 2025
    Inventors: Kuo-Chih HUANG, Yi-Tian LI
  • Patent number: 11937389
    Abstract: In one example, an electronic device housing may include a first cover, a second cover, and a latch assembly to detachably connect the first cover and the second cover. The latch assembly may include a first bracket to fixedly engage with the first cover, a latch to slide back and forth along the first bracket between a lock position to hold the second cover and an unlock position to release the second cover, an elastic member disposed between the latch and the first bracket to generate a force to the latch to hold the second cover, and a cable connected to the latch. The cable may generate a pulling force to the latch to release the second cover when an external force is applied to the cable.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: March 19, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chan Woo Park, Chung Hua Ku, Kuo Chih Huang
  • Publication number: 20230317502
    Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Chenghan SHE, Kuo-Chih HUANG, Kuan-Lin YEH
  • Publication number: 20220397940
    Abstract: An apparatus can comprise a cover coupleable to a computing device and a latch mechanism. An example latch mechanism is actuatable via insertion of a portion of a shaft through an aperture of the latch mechanism to cause the cover to be disengaged from the computing device.
    Type: Application
    Filed: November 19, 2019
    Publication date: December 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chung-Hua Ku, Kuo-Chih Huang, Hung-Sung Pan
  • Publication number: 20220394869
    Abstract: In one example, an electronic device housing may include a first cover, a second cover, and a latch assembly to detachably connect the first cover and the second cover. The latch assembly may include a first bracket to fixedly engage with the first cover, a latch to slide back and forth along the first bracket between a lock position to hold the second cover and an unlock position to release the second cover, an elastic member disposed between the latch and the first bracket to generate a force to the latch to hold the second cover, and a cable connected to the latch. The cable may generate a pulling force to the latch to release the second cover when an external force is applied to the cable.
    Type: Application
    Filed: November 5, 2019
    Publication date: December 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chan Woo Park, Chung Hua Ku, Kuo Chih Huang
  • Publication number: 20220291722
    Abstract: In an example, an accessory dock may include a holder that is moveable between a stowed position disposed within a housing of a computing device and a deployed position extending out from the housing of the computing device. Further, the holder is to receive an accessory band of a device accessory when the holder is disposed in the deployed position so as to stow the device accessory on to an external portion of the housing of the computing device.
    Type: Application
    Filed: September 30, 2019
    Publication date: September 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hung Sung Pan, Kuo Chih Huang, Yung Yun Chen
  • Publication number: 20220210940
    Abstract: Examples of a dual injection-molded metal substrate have been described. In an example, a dual injection-molded metal substrate includes a magnesium alloy layer injection-molded on a portion of a first surface of an injection-molded aluminum alloy substrate.
    Type: Application
    Filed: September 6, 2019
    Publication date: June 30, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi Hao Chang, Kuo Chih Huang, Kuan-Ting Wu
  • Patent number: 11301004
    Abstract: A system for reducing degradation of Wi-Fi signals for computers includes a first antenna of a Wi-Fi module disposed within a first region of the computer and a second antenna of the Wi-Fi module disposed within a second region of the computer wherein the regions are separated by a distance such that the first antenna and the second antenna are not subjected to degradation of the Wi-Fi signal at the same time due to a user's hands blocking the Wi-Fi signal when typing.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: April 12, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chun-Chih Liu, Chih-Chen Hung, Kuo-Chih Huang, Cheng-Feng Liao
  • Publication number: 20220066581
    Abstract: A panel for a touch screen of an electronic device is described. The panel comprises a substrate having a central area for operating the touch screen and a border area at an edge of the central area. The border area comprises a decorative image on the substrate and an outer surface coating overlying the decorative image. The decorative image comprises a non-conductive metallic coating. The outer surface coating comprises a non-conductive, printed layer. A method for manufacturing the panel and an electronic device comprising a touch screen having the panel are also described.
    Type: Application
    Filed: January 9, 2019
    Publication date: March 3, 2022
    Inventors: CHUNG HUA KU, KUO-CHIH HUANG, CHI HAO CHANG, KUAN-TING WU
  • Publication number: 20210208637
    Abstract: A system for reducing degradation of Wi-Fi signals for computers includes a first antenna of a Wi-Fi module disposed within a first region of the computer and a second antenna of the Wi-Fi module disposed within a second region of the computer wherein the regions are separated by a distance such that the first antenna and the second antenna are not subjected to degradation of the Wi-Fi signal at the same time due to a user's hands blocking the Wi-Fi signal when typing.
    Type: Application
    Filed: April 21, 2017
    Publication date: July 8, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chun-Chih LIU, Chih-Chen HUNG, Kuo-Chih HUANG, Cheng-Feng LIAO
  • Publication number: 20210121952
    Abstract: In an example, a device cover may comprise a substrate and a metal luster layer having a lustrous paint formulation applied to an outer surface of the substrate. The lustrous paint formulation may comprise base particles with surfaces partially coated with metal nanoparticles. The metal nanoparticles may be disposed in a non-continuous manner on the base particles.
    Type: Application
    Filed: June 6, 2017
    Publication date: April 29, 2021
    Inventors: CHI HAO CHANG, KUAN-TING WU, KUO CHIH HUANG, CHUNG HUA KU
  • Publication number: 20200283335
    Abstract: In one example, a method is described, which may include chemically etching a glass substrate to form a porous surface, coating an anti-glare layer on the porous surface, coating an anti-fingerprint layer on the anti-glare layer, and curing the anti-glare layer and the anti-fingerprint layer formed on the porous surface to form a protective panel.
    Type: Application
    Filed: November 16, 2017
    Publication date: September 10, 2020
    Inventors: KUAN-TING WU, KUO-CHIH HUANG, HANG YAN YUEN, CHI HAO CHANG
  • Publication number: 20200115565
    Abstract: The present subject matter relates to polymer coating of a metal alloy substrate. The metal alloy substrate has an electrolytically deposited nano-ion polymer layer thereon. The nano-ion polymer layer is of a polyacrylic material or an epoxy resin.
    Type: Application
    Filed: April 11, 2017
    Publication date: April 16, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi-Hao Chang, Kuo-Chih Huang, Kuan-Ting Wu
  • Publication number: 20190033007
    Abstract: In one example, a heat pipe. The heat pipe includes a sealed, hollow, thermally conductive casing. A wick is disposed on interior walls of the casing. The wick includes an aerogel of carbon nanotubes and graphene. A working fluid is disposed in a cavity defined by the casing and the wick.
    Type: Application
    Filed: April 21, 2016
    Publication date: January 31, 2019
    Inventors: Kuan-Ting WU, Chi-Hao CHANG, Kuo-Chih HUANG, Hei Leng LIM, Kevin VOSS
  • Publication number: 20150054346
    Abstract: A wireless power supply device is adapted to a main body of an electronic device. The main body of the electronic device defines a power receiving compartment where the wireless power supply device is received. The wireless power supply device includes a wireless power receiver having a circuit board and a sensing coil. The sensing coil is disposed on and electrically connected to the circuit board, and the circuit board has two wires. The wireless power supply device also includes a shell conforming to the power receiving compartment. The shell has an anode portion and a cathode portion, the anode portion corresponds to an anode in the power receiving compartment and the cathode portion corresponds to a cathode in the power receiving compartment. The two wires respectively connect to the anode portion and cathode portion of the shell.
    Type: Application
    Filed: October 24, 2013
    Publication date: February 26, 2015
    Inventors: KUO-CHIH HUANG, CHIH-JEN LIN
  • Patent number: 7898615
    Abstract: An exemplary backlight module includes a light source and a light guide plate. The light guide plate includes a light incident surface positioned for receiving light beams from the light source, a bottom surface adjacent to the light incident surface, reflective structures provided on the bottom surface, and a light emitting surface configured for emission of the light beams. Each of the reflective structures partially overlaps corresponding adjacent reflective structures at one side, and is partially overlapped by corresponding adjacent reflective structures at an opposite side. A liquid crystal display including the backlight module is also provided.
    Type: Grant
    Filed: December 29, 2007
    Date of Patent: March 1, 2011
    Assignee: Chimel Innolux Corporation
    Inventors: Chih-Chung Hsiao, Kuo-Chih Huang
  • Patent number: 7762845
    Abstract: A thin connector structure includes an upper iron shell, a lower iron shell, a circuit board, a protective layer and a glue layer. The circuit board is interposed between the upper and lower iron shells. Both sides on the inner surface of the lower iron shell are provided with a pin, respectively. Both sides of the circuit board have a fixing hole, respectively. The pins go through the corresponding fixing holes. The protective layer is interposed between the upper iron shell and the circuit board to prevent dissipation of electromagnetic waves. The glue layer is interposed between the lower iron shell and the circuit board for positioning the connector structure.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: July 27, 2010
    Assignee: GEM-SUN Technologies Co., Ltd.
    Inventors: Kuo-chih Huang, Wen-Tsan Huang
  • Publication number: 20080158478
    Abstract: An exemplary backlight module includes a light source and a light guide plate. The light guide plate includes a light incident surface positioned for receiving light beams from the light source, a bottom surface adjacent to the light incident surface, reflective structures provided on the bottom surface, and a light emitting surface configured for emission of the light beams. Each of the reflective structures partially overlaps corresponding adjacent reflective structures at one side, and is partially overlapped by corresponding adjacent reflective structures at an opposite side. A liquid crystal display including the backlight module is also provided.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 3, 2008
    Inventors: Chih-Chung Hsiao, Kuo-Chih Huang
  • Patent number: 5617328
    Abstract: An automatic code pattern generator apparatus is disclosed which has a processor. The processor is for receiving a plurality of instructions including an instruction indicating a particular polygon specification associated with cells of at least one physical layer of a pre-programmed integrated circuit chip. The processor also receives at least one instruction indicating a regular ordered pattern of a plurality of the cells on the physical layers of the pre-programmed integrated circuit chip. The processor generates a code layer including a design of a layout of the polygons according to the regularly ordered pattern on the physical layers of the pre-programmed integrated circuit. The generated code layer also includes a mapping relationship between cell addresses, and corresponding ones of the cells associated with the polygons. The processor may also receive information indicating variations in particular addressed cells associated with the polygons of the regularly ordered pattern of cells.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: April 1, 1997
    Assignee: Winbond Electronics Corporation
    Inventors: Chiu-Mei Tsai, Mei-Ling Kuo, Kuo-Chih Huang
  • Patent number: D1053697
    Type: Grant
    Filed: April 13, 2023
    Date of Patent: December 10, 2024
    Assignee: Nan Juen International Co., Ltd.
    Inventors: Fu-Tien Chang, Kuo-Chih Huang, Jing Chen, Jia-Hung Tsai, Jia-Zhang Wang