Patents by Inventor Kuo-Chin Lin

Kuo-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230001673
    Abstract: A composite thermoplastic film and the manufacturing method are provided in the present invention. The method includes: providing a first structural layer and a second structural layer; performing a co-extrusion step to form a composite layer, in which to use a first extruding machine to perform the co-extrusion step, so the first structural layer is divided into a first thermal fuse film and a third thermal fuse film, and use a second extruding machine to perform the co-extrusion step, so the second structural layer is formed as a second thermal fuse film and disposed between the first thermal fuse film and the third thermal fuse film to form a composite layer; and performing a film-forming step, the composite layer is cooled to form a film through a forming wheel, and a rotating speed of the forming wheel can be controlled to acquire a desired thickness of the composite thermoplastic film.
    Type: Application
    Filed: March 7, 2022
    Publication date: January 5, 2023
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI
  • Publication number: 20230001680
    Abstract: A thermoplastic film composed of a single-layer of thermally fuse film. The single-layer of thermally fuse film has a melting point of 50° C.-160° C. and a Shore hardness ranges from 40 A-80 A. The present invention also provides another thermoplastic film, which has a multi-layer structure and the multi-layer structure from bottom to top, there are first thermally fuse film, second thermal fuse and third thermally fuse film. The thickness ratio of the first thermally fuse film, the second thermally fuse film and the third thermally fuse film is 1:1-2:1, in which the thermally fuse film, the first thermally fuse film, the second thermally fuse film, and the third thermally fuse film are thermoplastic polyurethane respectively, and thermoplastic polyurethane contains aromatic functional group or with aliphatic functional group.
    Type: Application
    Filed: March 22, 2022
    Publication date: January 5, 2023
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI
  • Publication number: 20220384286
    Abstract: A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip over the substrate. The chip package structure includes a first heat conductive layer between the heat-spreading wall structure and the chip. The chip package structure includes a second heat conductive layer over the chip and surrounded by the first heat conductive layer. The chip package structure includes a heat-spreading lid over the substrate and covering the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Shin CHI, Chien Hao HSU, Kuo-Chin CHANG, Cheng-Nan LIN, Mirng-Ji LII
  • Patent number: 11450588
    Abstract: A method for forming a chip package structure is provided. The method includes disposing a chip over a substrate. The method includes forming a heat-spreading wall structure over the substrate. The heat-spreading wall structure is adjacent to the chip, and there is a first gap between the chip and the heat-spreading wall structure. The method includes forming a first heat conductive layer in the first gap. The method includes forming a second heat conductive layer over the chip. The method includes disposing a heat-spreading lid over the substrate to cover the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shin Chi, Chien-Hao Hsu, Kuo-Chin Chang, Cheng-Nan Lin, Mirng-Ji Lii
  • Publication number: 20220233799
    Abstract: A ventilator-weaning timing prediction system, a program product therefor, and methods for building and using the same are disclosed to help a physician to determine a timing for a ventilator-using patient to try to weaning or completely wean from mechanical ventilation using AI-based prediction.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 28, 2022
    Inventors: Jhi-Joung Wang, Hung-Jung Lin, Kuo-Chen Cheng, Shian-Chin Ko, Chin-Ming Chen, Shu-Chen Hsing, Mei-Yi Sung, Chung-Feng Liu, Chia-Jung Chen
  • Patent number: 11056819
    Abstract: A connector is provided. The connector includes a shell assembly, a circuit board, a terminal, and an insulated block. The terminal includes a contact piece and a connecting piece including a connecting portion and a connecting pin, and an angle is between the connecting portion and the connecting pin. The insulated block is disposed on one side of the shell assembly, and the connecting pin passes through the insulated block to be connected to the circuit board. The connecting portion and a bending portion of the connecting piece are both embedded in the insulated block. The periphery of the contact piece is devoid of material receiving areas. The contact area of the contact piece has a pleasing appearance. Moreover, as the bending portion is completely embedded in the insulated block, insufficient molding and burr phenomenon during molding can be avoided.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: July 6, 2021
    Assignee: LUXSHARE PRECISION INDUSTRY (SUZHOU) CO., LTD.
    Inventors: Hong-Wei Sun, Tao Wang, Kuo-Chin Lin
  • Publication number: 20200371425
    Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Chun-Chieh TIEN, Cheng-Hsuen CHIANG, Chih-Ming CHEN, Cheng-Ming LIN, Yen-Wei HUANG, Hao-Ming CHANG, Kuo-Chin LIN, Kuan-Shien LEE
  • Publication number: 20200266571
    Abstract: A connector is provided. The connector includes a shell assembly, a circuit board, a terminal, and an insulated block. The terminal includes a contact piece and a connecting piece including a connecting portion and a connecting pin, and an angle is between the connecting portion and the connecting pin. The insulated block is disposed on one side of the shell assembly, and the connecting pin passes through the insulated block to be connected to the circuit board. The connecting portion and a bending portion of the connecting piece are both embedded in the insulated block. The periphery of the contact piece is devoid of material receiving areas. The contact area of the contact piece has a pleasing appearance. Moreover, as the bending portion is completely embedded in the insulated block, insufficient molding and burr phenomenon during molding can be avoided.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 20, 2020
    Applicant: Luxshare Precision Industry (Suzhou) Co., Ltd.
    Inventors: Hong-Wei Sun, Tao Wang, Kuo-Chin Lin
  • Patent number: 10739671
    Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: August 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Tien, Cheng-Hsuen Chiang, Chih-Ming Chen, Cheng-Ming Lin, Yen-Wei Huang, Hao-Ming Chang, Kuo Chin Lin, Kuan-Shien Lee
  • Patent number: 10508953
    Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: December 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Min-An Yang, Hao-Ming Chang, Shao-Chi Wei, Kuo-Chin Lin, Sheng-Chang Hsu, Li-Chih Lu, Cheng-Ming Lin
  • Publication number: 20190146326
    Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.
    Type: Application
    Filed: February 26, 2018
    Publication date: May 16, 2019
    Inventors: Chun-Chieh TIEN, Cheng-Hsuen CHIANG, Chih-Ming CHEN, Cheng-Ming LIN, Yen-Wei HUANG, Hao-Ming CHANG, Kuo Chin LIN, Kuan-Shien LEE
  • Publication number: 20180161828
    Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.
    Type: Application
    Filed: April 18, 2017
    Publication date: June 14, 2018
    Inventors: Min-An YANG, Hao-Ming CHANG, Shao-Chi WEI, Kuo-Chin LIN, Sheng-Chang HSU, Li-Chih LU, Cheng-Ming LIN
  • Patent number: 9722369
    Abstract: An electrical connector includes an insulating housing, a dielectric body, a plurality of terminals integrally molded to the dielectric body, a shielding plate and a plurality of metal elements. The shielding plate is integrally molded to the dielectric body. The dielectric body together with the terminals and the shielding plate is assembled to a rear end of the insulating housing. The metal elements are mounted to a top surface and a bottom surface of the dielectric body. Each of the metal elements has a base plate, and a touch portion extended from the base plate. The base plates of the metal elements are mounted to the top surface and the bottom surface of the dielectric body, respectively. A tail end of the touch portion contacts the shielding plate. One side of the touch portion contacts one of the grounding terminals.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: August 1, 2017
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Yi-Ching Hsu, Pei-Yi Lin, Kuo-Chin Lin, Han-Wei Wang
  • Patent number: 9564715
    Abstract: An electrical connector includes a dielectric body, a plurality of terminals integrally molded to the dielectric body, an insulating housing, two shielding elements, and a shielding shell surrounding the dielectric body, the insulating housing and the shielding elements. The insulating housing has a top wall, a bottom wall, two side walls and a rear wall. A top surface of the top wall and a bottom surface of the bottom wall of the insulating housing are recessed inward to form two fastening cavities. The dielectric body together with the terminals is assembled to the insulating housing. The two shielding elements are fastened to the two fastening cavities, respectively.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: February 7, 2017
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Pei-Yi Lin, Yi-Ching Hsu, Kuo-Chin Lin, Han-Wei Wang, Sheng-Nan Yu
  • Publication number: 20150363512
    Abstract: A system for optimizing connector design includes at least one digital model, an operating interface, an orthogonal table generating module, a model generating module, a definite element analysis module, a taguchi calculating module and a report module. A method for optimizing connector design is described hereinafter. Choose the digital model, and choose a target analysis element, a quality characteristics, tolerances of terminal thickness, tolerances of butting dimensions, orthogonal table format, and key dimensions and tolerances of the digital model. Generate multiple test parameters, and generate multiple groups of test models according to the digital model, the tolerances of terminal thickness, the tolerances of butting dimensions and the test parameters. Proceed a definite element analysis to get the parameters of the insertion and withdrawal forces according to the test models. Proceed a taguchi calculation to get relation variances, and make an analysis report according to the relation variances.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 17, 2015
    Inventors: SHENG YUAN HUANG, YI CHING HSU, KUO CHIN LIN, HAN WEI WANG
  • Patent number: 9093806
    Abstract: An electrical connector includes an insulating body, a plurality of terminals, a metal slice and an internal shell. The insulating body is divided into an upper half body and a lower half body which have the same structure to make the insulating body symmetric about the horizontal center plane thereof. Two face-to-face faces of the upper half body and the lower half body are respectively concaved upward and downward to form a pair of receiving cavities which together form a holding slot. The metal slice is held in the holding slot. The terminals are integrated in the upper half body and the lower half body of the insulating body. The internal shell sheathes outside the insulating body with front ends of the terminals being exposed outside through the internal shell.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 28, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Lin Yang, Kuo-Chin Lin
  • Patent number: 9077109
    Abstract: A card connector includes an insulating housing, a plurality of conductive terminals integrally molded to the insulating housing, an ejection mechanism, a card tray slidably assembled to the insulating housing, and at least one restraining element restrained in one side of the card tray. The insulating housing includes a bottom wall, a first side wall, a second side wall, and a rear wall which defines a recess. The second side wall defines a sliding groove. A bottom surface of the sliding groove is concaved downward to form a heart-shaped tracking groove. The ejection mechanism includes a connecting element slidably disposed in the sliding groove, a push button, a guiding element slidably disposed in the sliding groove, a rotating element rotatably disposed in the recess and an elastic element. The push button is mounted to the connecting element and projects beyond a front surface of the insulating housing.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 7, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Kuo-Chin Lin, Sheng Nan Yu, Chih Hsien Chiang
  • Publication number: 20150188257
    Abstract: A card connector includes an insulating housing, a plurality of conductive terminals integrally molded to the insulating housing, an ejection mechanism, a card tray slidably assembled to the insulating housing, and at least one restraining element restrained in one side of the card tray. The insulating housing includes a bottom wall, a first side wall, a second side wall, and a rear wall which defines a recess. The second side wall defines a sliding groove. A bottom surface of the sliding groove is concaved downward to form a heart-shaped tracking groove. The ejection mechanism includes a connecting element slidably disposed in the sliding groove, a push button, a guiding element slidably disposed in the sliding groove, a rotating element rotatably disposed in the recess and an elastic element. The push button is mounted to the connecting element and projects beyond a front surface of the insulating housing.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 2, 2015
    Applicant: Cheng Uei Precision Industry Co., Ltd.
    Inventors: KUO-CHIN LIN, SHENG NAN YU, CHIH HSIEN CHIANG
  • Publication number: 20150162681
    Abstract: A card connector includes an insulating housing, a plurality of conductive terminals, at least one ejection mechanism, at least one reset mechanism, a shielding shell and a card tray. The reset mechanism is disposed to a front of the insulating housing with a base portion located at a front thereof elastically projecting beyond a front surface of the insulating housing. The card tray slidably disposed to the insulating housing includes a base board, and a cover portion protruded forward and then spread outward from a front end of the base board and projecting beyond the front end of the base board. The front surface of the base portion of the reset mechanism abuts against a rear surface of an enclosure of the electronic device so as to make a front surface of the cover portion be flush with an outer surface of the electronic device.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Applicant: Cheng Uei Precision Industry Co., Ltd.
    Inventors: KUO WEI CHEN, SHENG NAN YU, KUO-CHIN LIN
  • Patent number: D733658
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: July 7, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Lin Yang, Kuo-Chin Lin