Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.

Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.

Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.

Abstract: A connector is provided. The connector includes a shell assembly, a circuit board, a terminal, and an insulated block. The terminal includes a contact piece and a connecting piece including a connecting portion and a connecting pin, and an angle is between the connecting portion and the connecting pin. The insulated block is disposed on one side of the shell assembly, and the connecting pin passes through the insulated block to be connected to the circuit board. The connecting portion and a bending portion of the connecting piece are both embedded in the insulated block. The periphery of the contact piece is devoid of material receiving areas. The contact area of the contact piece has a pleasing appearance. Moreover, as the bending portion is completely embedded in the insulated block, insufficient molding and burr phenomenon during molding can be avoided.

Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.

Abstract: A connector is provided. The connector includes a shell assembly, a circuit board, a terminal, and an insulated block. The terminal includes a contact piece and a connecting piece including a connecting portion and a connecting pin, and an angle is between the connecting portion and the connecting pin. The insulated block is disposed on one side of the shell assembly, and the connecting pin passes through the insulated block to be connected to the circuit board. The connecting portion and a bending portion of the connecting piece are both embedded in the insulated block. The periphery of the contact piece is devoid of material receiving areas. The contact area of the contact piece has a pleasing appearance. Moreover, as the bending portion is completely embedded in the insulated block, insufficient molding and burr phenomenon during molding can be avoided.

Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.

Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.

Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.

Abstract: A method for processing a substrate is provided. The method includes supplying a first flow of a chemical solution into a processing chamber, configured to process the substrate, via a first dispensing nozzle. The method further includes producing a first thermal image of the first flow of the chemical solution. The method also includes performing an image analysis on the first thermal image. In addition, the method includes moving the substrate into the processing chamber when the result of the analysis of the first thermal image is within the allowable deviation from the baseline.

Abstract: An electrical connector includes an insulating housing, a dielectric body, a plurality of terminals integrally molded to the dielectric body, a shielding plate and a plurality of metal elements. The shielding plate is integrally molded to the dielectric body. The dielectric body together with the terminals and the shielding plate is assembled to a rear end of the insulating housing. The metal elements are mounted to a top surface and a bottom surface of the dielectric body. Each of the metal elements has a base plate, and a touch portion extended from the base plate. The base plates of the metal elements are mounted to the top surface and the bottom surface of the dielectric body, respectively. A tail end of the touch portion contacts the shielding plate. One side of the touch portion contacts one of the grounding terminals.

Abstract: An electrical connector includes a dielectric body, a plurality of terminals integrally molded to the dielectric body, an insulating housing, two shielding elements, and a shielding shell surrounding the dielectric body, the insulating housing and the shielding elements. The insulating housing has a top wall, a bottom wall, two side walls and a rear wall. A top surface of the top wall and a bottom surface of the bottom wall of the insulating housing are recessed inward to form two fastening cavities. The dielectric body together with the terminals is assembled to the insulating housing. The two shielding elements are fastened to the two fastening cavities, respectively.

Abstract: A system for optimizing connector design includes at least one digital model, an operating interface, an orthogonal table generating module, a model generating module, a definite element analysis module, a taguchi calculating module and a report module. A method for optimizing connector design is described hereinafter. Choose the digital model, and choose a target analysis element, a quality characteristics, tolerances of terminal thickness, tolerances of butting dimensions, orthogonal table format, and key dimensions and tolerances of the digital model. Generate multiple test parameters, and generate multiple groups of test models according to the digital model, the tolerances of terminal thickness, the tolerances of butting dimensions and the test parameters. Proceed a definite element analysis to get the parameters of the insertion and withdrawal forces according to the test models. Proceed a taguchi calculation to get relation variances, and make an analysis report according to the relation variances.

Abstract: An electrical connector includes an insulating body, a plurality of terminals, a metal slice and an internal shell. The insulating body is divided into an upper half body and a lower half body which have the same structure to make the insulating body symmetric about the horizontal center plane thereof. Two face-to-face faces of the upper half body and the lower half body are respectively concaved upward and downward to form a pair of receiving cavities which together form a holding slot. The metal slice is held in the holding slot. The terminals are integrated in the upper half body and the lower half body of the insulating body. The internal shell sheathes outside the insulating body with front ends of the terminals being exposed outside through the internal shell.

Abstract: A card connector includes an insulating housing, a plurality of conductive terminals integrally molded to the insulating housing, an ejection mechanism, a card tray slidably assembled to the insulating housing, and at least one restraining element restrained in one side of the card tray. The insulating housing includes a bottom wall, a first side wall, a second side wall, and a rear wall which defines a recess. The second side wall defines a sliding groove. A bottom surface of the sliding groove is concaved downward to form a heart-shaped tracking groove. The ejection mechanism includes a connecting element slidably disposed in the sliding groove, a push button, a guiding element slidably disposed in the sliding groove, a rotating element rotatably disposed in the recess and an elastic element. The push button is mounted to the connecting element and projects beyond a front surface of the insulating housing.

Abstract: A card connector includes an insulating housing, a plurality of conductive terminals integrally molded to the insulating housing, an ejection mechanism, a card tray slidably assembled to the insulating housing, and at least one restraining element restrained in one side of the card tray. The insulating housing includes a bottom wall, a first side wall, a second side wall, and a rear wall which defines a recess. The second side wall defines a sliding groove. A bottom surface of the sliding groove is concaved downward to form a heart-shaped tracking groove. The ejection mechanism includes a connecting element slidably disposed in the sliding groove, a push button, a guiding element slidably disposed in the sliding groove, a rotating element rotatably disposed in the recess and an elastic element. The push button is mounted to the connecting element and projects beyond a front surface of the insulating housing.

Abstract: A card connector includes an insulating housing, a plurality of conductive terminals, at least one ejection mechanism, at least one reset mechanism, a shielding shell and a card tray. The reset mechanism is disposed to a front of the insulating housing with a base portion located at a front thereof elastically projecting beyond a front surface of the insulating housing. The card tray slidably disposed to the insulating housing includes a base board, and a cover portion protruded forward and then spread outward from a front end of the base board and projecting beyond the front end of the base board. The front surface of the base portion of the reset mechanism abuts against a rear surface of an enclosure of the electronic device so as to make a front surface of the cover portion be flush with an outer surface of the electronic device.

Abstract: A card connector includes an insulating housing, a plurality of contacts, a projection and a detecting contact set. The insulating housing includes a bottom wall, a right wall and a left wall for defining a receiving space. The contacts are received in the insulating housing. The projection is protruded from the right wall and into the receiving space, which includes a slanting surface slanted relative to the right wall. The detecting contact set is fixed in the insulating housing, which includes a contacting arm protruding from the slating surface of the projection and into the receiving space. Due to the contacting arm of the detecting contact set is protruded from the slanting surface of the projection in the receiving space, the detecting contact set will be actuated while a card is inserted into the receiving space correctly and completely. Since, the detecting accuracy of the card connector is improved.