Patents by Inventor Kuo Ching Lee

Kuo Ching Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100304609
    Abstract: A coaxial connector has a metal shell, an insulative housing and a terminal. The metal shell has a body, a cavity defined in the body and a clamping cover formed on the body. The insulative housing is mounted in the cavity and has a base, a chamber defined in the base and a wire-pressing member being resilient and formed on the base. The terminal is mounted in the chamber and has a plate aligned with the wire-pressing member and two contacting arms protruding from the plate. When a coaxial cable is connected to the coaxial connector, the wire-pressing member is bent to precisely position a core wire of the coaxial cable on the plate and stabilize signal transmission between the coaxial connector and a coaxial cable.
    Type: Application
    Filed: August 7, 2009
    Publication date: December 2, 2010
    Applicant: Advanced Connectek Inc.
    Inventors: Kuo-Ching LEE, Jian-Guang Guo, Yu-Long Wang
  • Patent number: 7789673
    Abstract: A plug connector has an insulative housing and a plurality of signal terminals. The insulative housing has a plurality mounting channels and each mounting channel has an interfering portion. The signal terminals are mounted respectively in the mounting channels and each signal terminals has a first clamping portion and a second clamping portion. Each of the first and second clamping portions has at least on barb stabbing and biting the interfering portion of a corresponding mounting channel to securely hold the signal terminal in the insulative housing.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: September 7, 2010
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan
  • Patent number: 7731541
    Abstract: A backplane connector has a housing, a first insulative base, a second insulative base, multiple first terminals, multiple second terminals and multiple third terminals. Each of the insulative bases is mounted in the housing and is formed into one-piece. The first terminals are mounted on the first insulative base. The second terminals are mounted on the second insulative base. The third terminals are mounted on the insulative bases. The one-piece insulative bases excellently reduce their tolerances and raise the structurally strength of the backplane connector. Therefore, the production rate of the backplane connector increases.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: June 8, 2010
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan, Fu-Zhi Gong
  • Patent number: 7614898
    Abstract: An electrical connector for engaging with an electronic card has a insulative housing with a plurality of receiving spaces, a plurality of terminals respectively mounted in the receiving spaces of the insulative housing, and an operating member pivotally connected to the insulative housing. The operating member controls the terminals in the insulative housing to be moved for electrically and mechanically engagement with the electronic card. Each of the terminals has a base portion, an upper arm and a lower arm. The upper arm is connected to the base portion at a joint as a first fulcrum. The lower arm is connected to the base portion at another joint as a second fulcrum. As the operating member pivotally moves to a predetermined position, the upper arm and the lower arm respectively rotate about the first fulcrum and the second fulcrum to securely grasp the electronic card.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: November 10, 2009
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan
  • Publication number: 20090221156
    Abstract: A plug connector has an insulative housing and a plurality of signal terminals. The insulative housing has a plurality mounting channels and each mounting channel has an interfering portion. The signal terminals are mounted respectively in the mounting channels and each signal terminals has a first clamping portion and a second clamping portion. Each of the first and second clamping portions has at least on barb stabbing and biting the interfering portion of a corresponding mounting channel to securely hold the signal terminal in the insulative housing.
    Type: Application
    Filed: November 3, 2008
    Publication date: September 3, 2009
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan
  • Publication number: 20090061689
    Abstract: An electrical connector for engaging with an electronic card has a insulative housing with a plurality of receiving spaces, a plurality of terminals respectively mounted in the receiving spaces of the insulative housing, and an operating member pivotally connected to the insulative housing. The operating member controls the terminals in the insulative housing to be moved for electrically and mechanically engagement with the electronic card. Each of the terminals has a base portion, an upper arm and a lower arm. The upper arm is connected to the base portion at a joint as a first fulcrum. The lower arm is connected to the base portion at another joint as a second fulcrum. As the operating member pivotally moves to a predetermined position, the upper arm and the lower arm respectively rotate about the first fulcrum and the second fulcrum to securely grasp the electronic card.
    Type: Application
    Filed: August 21, 2008
    Publication date: March 5, 2009
    Applicant: ADVANCED CONNECTEK INC.
    Inventors: Kuo-Ching LEE, Ta-Teh MENG, Jian-Li GUAN
  • Patent number: 6715524
    Abstract: A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: April 6, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su
  • Publication number: 20030234079
    Abstract: Plasma ashing and/or etching using a solid sapphire disk is disclosed. A plasma etcher/asher of one embodiment of the invention includes at least a chamber body, upper and lower baffles, and a solid sapphire disk. The chamber body defines an interior chamber in which a semiconductor wafer is positionable for etching or ashing. The baffles are positioned over the semiconductor wafer, and distribute gas onto the semiconductor wafer. The solid sapphire disk has no holes, and is positioned over one of the baffles to affect distribution of the gas onto the semiconductor wafer. The solid sapphire disk of the invention provides for more uniform distribution of the gas onto the semiconductor wafer. As a result, etching or ashing of the semiconductor wafers occurs more uniformly, providing for more uniformly thick wafers.
    Type: Application
    Filed: June 19, 2002
    Publication date: December 25, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yue-Ying Jiang, Kuo-Ching Lee, Wen-Chang Kuo, Yih-Ann Lin, Cheng-Ta Lin
  • Publication number: 20030226638
    Abstract: A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.
    Type: Application
    Filed: June 7, 2002
    Publication date: December 11, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Chih Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su
  • Patent number: 6439975
    Abstract: A press die for forming a contact of an electrical connector by blanking a metal sheet is disclosed. The die has a die insert for shaving an engaging section of the contact for electrically engaging with a conductive portion of a device mating with the electrical connector so that an electrical connection between the connector and the device is created. A profile of the die insert for the shaving operation is subject to a final finishing process by an ultrasonic machining using a machining agent consisted of diamond particles dispersed in liquid, wherein the diamond particles have a grit size of 8000#. The profile of the die insert has a surface roughness of 0.08 Ra.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: August 27, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Tsang-Chien Shih, Kuo Ching Lee
  • Patent number: D576556
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: September 9, 2008
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan, Guo-Gang Miao
  • Patent number: D578481
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: October 14, 2008
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan, Mei Shi
  • Patent number: D588541
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: March 17, 2009
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan, Mei Shi
  • Patent number: D588542
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: March 17, 2009
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan, Guo-Gang Miao