Abstract: A transformable toy includes a transformable assembly, a bottom locking member, a top locking member and a resilient set. The transformable assembly includes a bottom plate and a top plate. The bottom locking member is disposed on the bottom plate and includes a bottom hook. The top locking member is disposed on the top plate and includes a top hook. The top locking member is able to be driven by a downward force to engage the top hook with the bottom hook. The bottom hook is able to be driven by an upward force opposite to the downward force to be disengaged from the top hook.

Abstract: A display system includes a display module and a controller. The display module is configured to display a first frame including a part image, wherein the part image is located in a first region of the first frame. The controller is configured on the display module and is configured to capture the part image of the first frame and displays the part image in a second region different from the first region. The controller responds to an operation for one of the first region and the second region, the same operation for the other of the first region and the second region is performed.

Abstract: A display system includes a display module and a controller. The display module is configured to display a first frame including a part image, wherein the part image is located in a first region of the first frame. The controller is configured on the display module and is configured to capture the part image of the first frame and displays the part image in a second region different from the first region. The controller responds to an operation for one of the first region and the second region, the same operation for the other of the first region and the second region is performed.

Abstract: An assembly toy includes first, second and third units. Each of the first, second and third units is substantially flat and elongated when the assembly toy is at a pre-assembled state, and is folded into a rectangular hollow prism when the assembly toy is at an assembled state. The third unit has a main portion and two spaced-apart connecting portions extending from an edge of the main portion. The second unit has two opposite decorating parts and is sleeved in the first unit in such manner that the decorating parts are exposed from the first unit when the assembly toy is at the assembled state. The connecting portions of the third unit are coupled to the first unit when the assembly toy is at the assembled state.

Abstract: A packaging box includes a foldable outer panel having a substantially rectangular wall-forming section with two opposite first bounding ends, two opposite second bounding ends extending between and interconnecting the first bounding ends, and a plurality or spaced-apart first folding lines that extend substantially parallel to and between the first bounding ends and that divide the wall-forming section into a plurality of surrounding walls. An object-retaining section is connected foldably to and extends away from one of the first bounding ends in a direction parallel to the second bounding ends, and has at least one retaining hole. A foldable inner panel is connected to one of the surrounding walls, and has two opposite end walls foldably disposed on the one of the surrounding walls.

Abstract: A package box includes a four-sided outer panel having a plurality of parallel panel fold lines and a connection region that is disposed between two adjacent ones of the panel fold lines, and a retainer made from a foldable panel and connected to the connection region. The retainer has two spaced-apart retainer walls, each of which has a bottom panel part connected to the connection region, a top panel part above the bottom panel part, and first and second side panel parts that interconnect the bottom and top panel parts. Each of the retainer walls is convertible between an erect used position, and a collapsed non-used position. The outer panel is folded along the panel fold lines to extend around the retainer.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid state laser and locating edges of the substrate. The cutting is stopped based on the edge location, to prevent impacting background elements. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire.

Abstract: A method of making an embossed card includes: (a) providing a stack which includes a substrate, a first polymeric layer formed on the substrate, a foam layer formed on the first polymeric layer, a non-woven fabric layer formed on the foam layer, and a second polymeric layer formed on the non-woven layer; (b) providing a printed pattern on the second polymeric layer; (c) providing a transparent film on the printed pattern so as to form a multilayer structure; and (d) embossing the multilayer structure so as to obtain the embossed card.

Abstract: A laser apparatus for producing a laser light beam can include a gain medium; a pump light source to provide a pump light beam to the gain medium; a first reflector disposed between the first gain medium and the first pump light source and spaced apart from a gain portion of the first gain medium; a second reflector; and an output coupler. The first reflector is substantially reflective to the laser light beam and substantially transmissive to the pump light beam. The first and second reflectors and the output coupler define a folded beam path having a first portion and a second portion. The first portion of the beam path extends from the first reflector to the second reflector through the gain medium and the second portion of the beam path extends from the first reflector to the output coupler through the gain medium. The first and second beam paths define, within the gain medium, a non-zero folding angle.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid-state laser. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire. Control of the system, such as by moving the stage with a stationary beam path for the pulses, causes the pulses to contact the sapphire substrate in a scribe pattern at a rate of motion causing overlap of successive pulses sufficient to cut scribe lines in the sapphire substrate.

Abstract: A laser apparatus for producing a laser light beam can include a gain medium; a pump light source to provide a pump light beam to the gain medium; a first reflector disposed between the first gain medium and the first pump light source and spaced apart from a gain portion of the first gain medium; a second reflector; and an output coupler. The first reflector is substantially reflective to the laser light beam and substantially transmissive to the pump light beam. The first and second reflectors and the output coupler define a folded beam path having a first portion and a second portion. The first portion of the beam path extends from the first reflector to the second reflector through the gain medium and the second portion of the beam path extends from the first reflector to the output coupler through the gain medium. The first and second beam paths define, within the gain medium, a non-zero folding angle.

Abstract: A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the substrate using a solid-state laser having controlled polarization. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the substrate using a solid-state laser having controlled polarization. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the conductive substrate using a solid-state laser. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the conductive substrate using a solid-state laser. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid state laser and locating edges of the substrate. The cutting is stopped based on the edge location, to prevent impacting background elements. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire.

Abstract: A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the substrate using a solid-state laser having controlled polarization. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid-state laser. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire. Control of the system, such as by moving the stage with a stationary beam path for the pulses, causes the pulses to contact the sapphire substrate in a scribe pattern at a rate of motion causing overlap of successive pulses sufficient to cut scribe lines in the sapphire substrate.

Abstract: A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed at a surface of the sapphire substrate using a solid-state laser. The pulses of laser energy have a wavelength below about 560 nanometers, and preferably between about 150 in 560 nanometers. In addition, energy density, spot size, and pulse duration are established at levels sufficient to induce ablation of sapphire. Control of the system, such as by moving the stage with a stationary beam path for the pulses, causes the pulses to contact the sapphire substrate in a scribe pattern at a rate of motion causing overlap of successive pulses sufficient to cut scribe lines in the sapphire substrate.

Abstract: A laser system includes a resonator having two gain modules generating pulses, coupled with intra-cavity polarization into a single beam line, using a single output coupler. A laser controller controls the laser heads to emit pulses in rapid succession, such as pulse pairs separated by a time interval of less than about 1 millisecond, and in some embodiments in a range from about zero (overlapping) to about 100 microseconds. Also a system adapted for metrology using particle image velocimetry PIV uses the resonator. For PIV, optics are provided in the output beam paths which expand the beam to form pulsed illumination sheets. A camera is used to capture images of the pulsed illumination sheets for analysis.