Patents by Inventor Kuo-Ching Wu
Kuo-Ching Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978740Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.Type: GrantFiled: February 17, 2022Date of Patent: May 7, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
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Publication number: 20240139142Abstract: Provided is a method for preventing or treating a liver disease, including administering a therapeutically effective amount of pharmaceutical composition to a subject in need, and the pharmaceutical composition includes the isothiocyanate structural modified compound and a pharmaceutically acceptable carrier thereof.Type: ApplicationFiled: September 14, 2023Publication date: May 2, 2024Applicants: TAIPEI VETERANS GENERAL HOSPITAL, NATIONAL YANG MING CHIAO TUNG UNIVERSITY, PHARMAESSENTIA CORPORATIONInventors: Jaw-Ching WU, Yung-Sheng CHANG, Kuo-Hsi KAO, Chan-Kou HWANG, Ko-Chung LIN
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Publication number: 20240136346Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.Type: ApplicationFiled: April 17, 2023Publication date: April 25, 2024Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
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Publication number: 20240088026Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.Type: ApplicationFiled: January 17, 2023Publication date: March 14, 2024Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
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Patent number: 11827521Abstract: A method for selectively chemically reducing CO2 to form CO includes providing a catalyst, and contacting H2 and CO2 with the catalyst to chemically reduce CO2 to form CO. The catalyst includes a metal oxide having a chemical formula of FexCoyMn(1?x?y)Oz, in which 0.7?x?0.95, 0.01?y?0.25, and z is an oxidation coordination number.Type: GrantFiled: December 14, 2021Date of Patent: November 28, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching Wu, Hsi-Yen Hsu, Chao-Huang Chen, Yuan-Peng Du
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Publication number: 20230348278Abstract: A method for selectively chemically reducing CO2 to form CO includes providing a catalyst, and contacting H2 and CO2 with the catalyst to chemically reduce CO2 to form CO. The catalyst includes a metal oxide having a chemical formula of FexCoyMn(1-x-y)Oz, in which 0.7?x?0.95, 0.01?y?0.25, and z is an oxidation coordination number.Type: ApplicationFiled: July 3, 2023Publication date: November 2, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching WU, Hsi-Yen HSU, Chao-Huang CHEN, Yuan-Peng DU
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Publication number: 20230183074Abstract: A method for selectively chemically reducing CO2 to form CO includes providing a catalyst, and contacting H2 and CO2 with the catalyst to chemically reduce CO2 to form CO. The catalyst includes a metal oxide having a chemical formula of FexCoyMn(1-x-y)Oz, in which 0.7?x?0.95, 0.01?y?0.25, and z is an oxidation coordination number.Type: ApplicationFiled: December 14, 2021Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching WU, Hsi-Yen HSU, Chao-Huang CHEN, Yuan-Peng DU
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Patent number: 11565244Abstract: A method of forming dialkyl carbonate is provided, which includes introducing carbon dioxide into a catalyst to form dialkyl carbonate, wherein the catalyst is formed by activating a catalyst precursor using alcohol, wherein alcohol is R3—OH, and R3 is C1-12 alkyl group or C5-12 aryl or heteroaryl group. The catalyst precursor is formed by reacting Sn(R1)2(L)2 and Ti(OR2)4, and Sn(R1)2(L)2 and Ti(OR2)4 have a molar ratio of 1:2 to 2:1. R1 is C1-10 alkyl group, R2 is H or C1-12 alkyl group, and L is O—(C?O)—R5, and R5 is C1-12 alkyl group.Type: GrantFiled: June 6, 2022Date of Patent: January 31, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Yao Yang, Kuo-Ching Wu, Hsi-Yen Hsu, Yu-Shan Chao
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Publication number: 20220297099Abstract: A method of forming dialkyl carbonate is provided, which includes introducing carbon dioxide into a catalyst to form dialkyl carbonate, wherein the catalyst is formed by activating a catalyst precursor using alcohol, wherein alcohol is R3—OH, and R3 is C1-12 alkyl group or C5-12 aryl or heteroaryl group. The catalyst precursor is formed by reacting Sn(R1)2(L)2 and Ti(OR2)4, and Sn(R1)2(L)2 and Ti(OR2)4 have a molar ratio of 1:2 to 2:1. R1 is C1-10 alkyl group, R2 is H or C1-12 alkyl group, and L is O—(C?O)—R5, and R5 is C1-12 alkyl group.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Yao YANG, Kuo-Ching WU, Hsi-Yen HSU, Yu-Shan CHAO
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Patent number: 11400440Abstract: A method of forming dialkyl carbonate is provided, which includes introducing carbon dioxide into a catalyst to form dialkyl carbonate, wherein the catalyst is formed by activating a catalyst precursor using alcohol, wherein alcohol is R3—OH, and R3 is C1-12 alkyl group or C5-12 aryl or heteroaryl group. The catalyst precursor is formed by reacting Sn(R1)2(L)2 and Ti(OR2)4, and Sn(R1)2(L)2 and Ti(OR2)4 have a molar ratio of 1:2 to 2:1. R1 is C1-10 alkyl group, R2 is H or C1-12 alkyl group, and L is O—(C?O)—R5, and R5 is C1-12 alkyl group.Type: GrantFiled: December 26, 2019Date of Patent: August 2, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Yao yang, Kuo-Ching Wu, Hsi-Yen Hsu, Yu-Shan Chao
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Publication number: 20210178374Abstract: A method of forming dialkyl carbonate is provided, which includes introducing carbon dioxide into a catalyst to form dialkyl carbonate, wherein the catalyst is formed by activating a catalyst precursor using alcohol, wherein alcohol is R3—OH, and R3 is C1-12 alkyl group or C5-12 aryl or heteroaryl group. The catalyst precursor is formed by reacting Sn(R1)2(L)2 and Ti(OR2)4, and Sn(R1)2(L)2 and Ti(OR2)4 have a molar ratio of 1:2 to 2:1. R1 is C1-10 alkyl group, R2 is H or C1-12 alkyl group, and L is O—(C?O)—R5, and R5 is C1-12 alkyl group.Type: ApplicationFiled: December 26, 2019Publication date: June 17, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Yao YANG, Kuo-Ching WU, Hsi-Yen HSU, Yu-Shan CHAO
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Publication number: 20190382522Abstract: A polycarbonate diol is provided. The polycarbonate diol includes repeating units represented by formula (A) and formula (B), and hydroxyl groups located at both ends of the polycarbonate diol. The molar ratio of formula (A) to formula (B) is in a range from 1:99 to 99:1. R1 is a linear, branched or cyclic C2-20 alkylene group. R2 is a linear or branched C2-10 alkylene group; m and n are independently and can be an integer from 0 to 10, and m+n?1. A is a C2-20 alicyclic hydrocarbon, aromatic ring or a structure represented by formula (C). R3 and R4 are independently and can be a hydrogen atom or a C1-6 alkyl group; S is 0 or 1; and Z is selected from R5 and R6 are independently and can be a hydrogen atom or a C1-12 hydrocarbon group.Type: ApplicationFiled: November 19, 2018Publication date: December 19, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Po KUO, Kuo-Ching WU, Wen-Pin CHUANG, Shu-Jiuan HUANG, Hsi-Yen HSU, Chiou-Hwang LEE
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Patent number: 10005068Abstract: A catalyst is provided. The catalyst includes a carrier and a metal. The carrier is represented by a formula: MxAl(1-x)O(3-x)/2, where M is an alkaline earth metal, and x is between 0.09 and 0.24. The metal is loaded on the carrier. A method for manufacturing the catalyst is also provided.Type: GrantFiled: December 9, 2016Date of Patent: June 26, 2018Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching Wu, Chiou-Hwang Lee
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Patent number: 9875924Abstract: A spray coater is used to spray a photoresist on a front surface of a wafer. The spray coater includes a vacuum chuck, a flow guiding ring, and a positioning ring. The vacuum chuck has a top surface and a side surface adjacent to the top surface. The wafer is located on the top surface and protrudes from the top surface of the vacuum chuck. The flow guiding ring is disposed around the vacuum chuck and has a groove. The wafer protruding from the top surface covers the flow guiding ring, and an opening of the groove faces a back surface of the wafer opposite to the front surface. The positioning ring is disposed around the flow guiding ring, such that the flow guiding ring is between the positioning ring and the side surface of the vacuum chuck.Type: GrantFiled: February 25, 2016Date of Patent: January 23, 2018Assignee: XINTEC INC.Inventors: Tsou-Tso Tsai, Kuo-Ching Wu, Tzung-Heng Tsai
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Publication number: 20170087536Abstract: A catalyst is provided. The catalyst includes a carrier and a metal. The carrier is represented by a formula: MxAl(1-x)O(3-x)/2, where M is an alkaline earth metal, and x is between 0.09 and 0.24. The metal is loaded on the carrier. A method for manufacturing the catalyst is also provided.Type: ApplicationFiled: December 9, 2016Publication date: March 30, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching WU, Chiou-Hwang LEE
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Patent number: 9545617Abstract: A catalyst is provided. The catalyst includes a carrier and a metal Pd. The carrier is represented by a formula: MxAl(1?x)O(3?x)/2, where M is an alkaline earth metal, and x is between 0.09 and 0.24. The metal Pd is loaded on the carrier. A method for manufacturing the catalyst and a method for manufacturing a hydrogenated bisphenol A or derivatives thereof using the catalyst are also provided.Type: GrantFiled: December 9, 2015Date of Patent: January 17, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ching Wu, Chiou-Hwang Lee
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Publication number: 20160250656Abstract: A spray coater is used to spray a photoresist on a front surface of a wafer. The spray coater includes a vacuum chuck, a flow guiding ring, and a positioning ring. The vacuum chuck has a top surface and a side surface adjacent to the top surface. The wafer is located on the top surface and protrudes from the top surface of the vacuum chuck. The flow guiding ring is disposed around the vacuum chuck and has a groove. The wafer protruding from the top surface covers the flow guiding ring, and an opening of the groove faces a back surface of the wafer opposite to the front surface. The positioning ring is disposed around the flow guiding ring, such that the flow guiding ring is between the positioning ring and the side surface of the vacuum chuck.Type: ApplicationFiled: February 25, 2016Publication date: September 1, 2016Inventors: Tsou-Tso TSAI, Kuo-Ching WU, Tzung-Heng TSAI
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Publication number: 20160158731Abstract: A catalyst is provided. The catalyst includes a carrier and a metal Pd. The carrier is represented by a formula: MxAl(1-x)O(3-x)/2, where M is an alkaline earth metal, and x is between 0.09 and 0.24. The metal Pd is loaded on the carrier. A method for manufacturing the catalyst and a method for manufacturing a hydrogenated bisphenol A or derivatives thereof using the catalyst are also provided.Type: ApplicationFiled: December 9, 2015Publication date: June 9, 2016Inventors: Kuo-Ching Wu, Chiou-Hwang Lee
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Patent number: 8722922Abstract: The disclosure provides a process for hydrogenation of polycarboxylic acids or derivatives thereof, including: hydrogenation of polycarboxylic acids or derivatives thereof in the presence of a catalyst, wherein the catalyst includes an active metal and a support, the support includes a Group IIA element and a Group IIIA element, and the active metal includes a Group VIIIB element.Type: GrantFiled: May 7, 2012Date of Patent: May 13, 2014Assignee: Industrial Technology Research InstituteInventors: Hsu-Kai Chang, Chion-Hwang Lee, Kuo-Ching Wu, Hsi-Yen Hsu
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Publication number: 20100263977Abstract: A support apparatus for wheeled luggage, comprising a luggage case and a frame member, wherein the frame member further comprises a first frame having two main legs and multiple wheels, and a second frame having multiple pivot fasteners and multiple wheels. When pulling the second frame, the second frame and the first frame will be unfolded to form in a shape of cross, so that the structure of the luggage case and the frame member will transform into a platform type, the users do not need to bend down their back or squat down to sort out the articles in the luggage case; furthermore, since the wheels are pivoted to the bottom ends of the first frame and second frame, so that the stability of the wheels is secured.Type: ApplicationFiled: May 7, 2009Publication date: October 21, 2010Inventor: Kuo Ching WU