Patents by Inventor Kuo-Chu Chiang

Kuo-Chu Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array semiconductor package and method of fabricating the same
    Patent number: 6818538
    Abstract: A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: November 16, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kuo-Chu Chiang, Yu-Ting Lai, Chin Te Chen
  • Ball grid array semiconductor package and method of fabricating the same
    Publication number: 20040169273
    Abstract: A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.
    Type: Application
    Filed: April 18, 2003
    Publication date: September 2, 2004
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Kuo-Chu Chiang, Yu-Ting Lai, Chin Te Chen