Abstract: A method includes bonding a first device die to a second device die through face-to-face bonding, wherein the second device die is in a device wafer, forming a gap-filling region to encircle the first device die, performing a backside-grinding process on the device wafer to reveal a through-via in the second device die, and forming a redistribution structure on the backside of the device wafer. The redistribution structure is electrically connected to the first device die through the through-via in the second device die. A supporting substrate is bonded to the first device die.

Abstract: An optical disc drive including a case, a first circuit board, a tray, a second circuit board and a cable is provided. The first circuit board is disposed on the case and a cable protection structure is located on the case. The tray is movably disposed inside the case, and the second circuit board is disposed on the tray. Two ends of the cable are electrically connected with the first circuit board and the second circuit board, respectively. The cable has at least one folding portion located in the cable protection structure.

Abstract: A suspension device for an optical media storage device having a spindle motor. The suspension device includes a loader, a traverse and a dynamic mass. The traverse is disposed on the loader and has a first weighted end. The mass center of the traverse is on the first weighted end and the spindle motor is disposed on the first weighted end. The dynamic mass is disposed on the traverse and has a second weighted end. The mass center of the dynamic mass is on the second weighted end and the second weighted end is located above the first weighted end. Thus, when the spindle motor operates, the vibration of the optical media storage device is reduced tremendously.