Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber. A first wick structure layer and a holding-down member are provided between the first and the second plate member and received in the airtight chamber. The holding-down member is located above the first wick structure layer, such that the first wick structure layer is held down by the holding-down member to be closely and flatly attached to the second plate member without warping.

Abstract: A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

Abstract: A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.

Abstract: A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

Abstract: A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

Abstract: A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber, and a first wick structure layer and a holding-down thin layer are provided between the first and the second plate member and superimposed in the airtight chamber. With the holding-down thin layer and the first wick structure layer being superimposed in the airtight chamber, the first wick structure layer is closely and flatly attached to the second plate member without warping.

Abstract: A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber. A first wick structure layer and a holding-down member are provided between the first and the second plate member and received in the airtight chamber. The holding-down member is located above the first wick structure layer, such that the first wick structure layer is held down by the holding-down member to be closely and flatly attached to the second plate member without warping.

Abstract: A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

Abstract: A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Abstract: A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Abstract: A flat-plate heat pipe structure includes a main body. The main body has a first board body, a second board body, a first capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other. The first capillary structure is disposed between the first and second board bodies. The first capillary structure and the first and second board bodies together define at least one vapor passage. Accordingly, when the flat-plate heat pipe is thinned, the flat-plate heat pipe still keeps having a vapor passage, whereby the vapor-liquid circulation efficiency of the flat-plate heat pipe will not be deteriorated due to thinning.

Abstract: A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Abstract: A heat dissipation unit includes a main body having an upper surface and a lower surface and at least one heat conduction member having a heat absorption face and a heat conduction face. The heat conduction face of the heat conduction member is disposed under the lower surface of the main body.

Abstract: A flat-plate heat pipe structure includes a main body. The main body has a first board body, a second board body, a first capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other. The first capillary structure is disposed between the first and second board bodies. The first capillary structure and the first and second board bodies together define at least one vapor passage. Accordingly, when the flat-plate heat pipe is thinned, the flat-plate heat pipe still keeps having a vapor passage, whereby the vapor-liquid circulation efficiency of the flat-plate heat pipe will not be deteriorated due to thinning.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber, and a first wick structure layer and a holding-down thin layer are provided between the first and the second plate member and superimposed in the airtight chamber. With the holding-down thin layer and the first wick structure layer being superimposed in the airtight chamber, the first wick structure layer is closely and flatly attached to the second plate member without warping.

Abstract: A straight-through structure of heat dissipation unit includes a first plate body and a second plate body correspondingly mated with each other to define a closed chamber. A hydrophilic layer is disposed on the surface of the closed chamber and a capillary structure is disposed in the closed chamber. The first plate body is formed with a first recess, a first perforation and a second recess. The first recess is connected with the capillary structure disposed on the third face of the second plate body. One end of the second recess abuts against the capillary structure. The capillary structure layer is not in contact with the first recess. The second plate body has a second perforation in alignment with the first perforation. When it is necessary to perforate the heat dissipation unit, the straight-through structure can keep the closed chamber in the vacuumed and airtight state.