Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.

Abstract: A fan impeller includes a plurality of fan blade assembly members, each one of the fan blade assembly members respectively includes a metal ring bracket and a plurality of metal blades, one end of each one of the metal blades is respectively connected to the corresponding metal ring bracket and the plurality of metal blades of each one of the fan blade assembly members arranged radially to circumference the corresponding metal ring bracket. The metal ring brackets are configured to stack with each other and the metal blades are arranged in a radial centric row, a width of at least one portion of each one of the metal blades is not smaller than a distance between any two adjacent metal blades along a fan impeller circumferential direction. Accordingly, metal blades of a greater width can be densely arranged on the fan impeller.

Abstract: A fan impeller includes a plurality of fan blade assembly members, each one of the fan blade assembly members respectively includes a metal ring bracket and a plurality of metal blades, one end of each one of the metal blades is respectively connected to the corresponding metal ring bracket and the plurality of metal blades of each one of the fan blade assembly members arranged radially to circumference the corresponding metal ring bracket. The metal ring brackets are configured to stack with each other and the metal blades are arranged in a radial centric row, a width of at least one portion of each one of the metal blades is not smaller than a distance between any two adjacent metal blades along a fan impeller circumferential direction. Accordingly, metal blades of a greater width can be densely arranged on the fan impeller.

Abstract: A wafer container includes a container body, which comprises a plurality of sidewalls, a bottom, and a top to define a space for containing wafers, an opening being formed on one sidewall, and a door with an outer surface and an inner surface. The top of the container body is disposed with a robotic flange which comprises a foolproof structure and a hemi-circular snap-hook portion that are disposed at the center and its circumference of a lower surface of the robotic flange facing the top. The foolproof structure has a geometric hole for a protruding portion on the top of the container body to be plugged in. After the protruding portion is plugged into the geometric hole, the robotic flange is further rotated along the container body about 180 degrees for the hemi-circular snap-hook portion to be engaged in a hemi-circular supporting portion on the top of the container body.

Abstract: An processing method is used for processing an image file of an image, in which the image is divided into a plurality of image blocks, and at least one row of the minimum coded units sequentially define the image as a plurality of bands. The processing method includes the following steps. An image file of an image is supplied, in which the image file includes a bit stream and exchangeable image file (EXIF) data. A band indicator of the EXIF data is read according to an expanded range. A segment in the bit stream corresponding to a band encompassed by the expanded range is decoded according to the read band indicator corresponding to the band of the expanded range, so as to obtain the band.

Abstract: A processing method for image file includes the following steps. An image file of an image is obtained, in which the image file includes a bit stream and an Exchangeable Image File (EXIF) data. A band indicator and a minimum coded unit (MCU) indicator are read according to an expanded range. A referential DC coefficient is obtained according to a hybrid direct current (DC) coefficient corresponding to a first MCU covered by the expanded range. A sub-clip of the MCU covered by the corresponding expanded range in the bit stream is decoded according to the read band indicator, the MCU indicator and the referential DC coefficient, so as to obtain at least one MCU.

Abstract: A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.

Abstract: A processing method for image file includes the following steps. An image file of an image is obtained, in which the image file includes a bit stream and an Exchangeable Image File (EXIF) data. A band indicator and a minimum coded unit (MCU) indicator are read according to an expanded range. A referential DC coefficient is obtained according to a hybrid direct current (DC) coefficient corresponding to a first MCU covered by the expanded range. A sub-clip of the MCU covered by the corresponding expanded range in the bit stream is decoded according to the read band indicator, the MCU indicator and the referential DC coefficient, so as to obtain at least one MCU.

Abstract: A wafer container includes a container body, composed of a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.

Abstract: A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, on one sidewall of which is formed with an opening and on the other sidewall opposite to the opening is formed with a back wall, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each side wall of the container body and the back wall, a long slot is further disposed on the side of purgeable supporting module facing the opening, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to an gas valve, wherein the purgeable supporting module is formed by a plurality of supporting ribs vertically arranged at intervals.

Abstract: An processing method is used for processing an image file of an image, in which the image is divided into a plurality of image blocks, and at least one row of the minimum coded units sequentially define the image as a plurality of bands. The processing method includes the following steps. An image file of an image is supplied, in which the image file includes a bit stream and exchangeable image file (EXIF) data. A band indicator of the EXIF data is read according to an expanded range. A segment in the bit stream corresponding to a band encompassed by the expanded range is decoded according to the read band indicator corresponding to the band of the expanded range, so as to obtain the band.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which, and a door, which is joined with opening of the container body for protecting the plurality of wafers in the container body, the characteristic in that: a magnetic member is formed at the inner edge of the opening of the container body and a magnet is disposed at the inner surface of the door corresponding to the magnetic member, the magnet being disposed in a magnetic yoke with recessed cross section, with the design of which the magnet on the door attracts the magnetic member at the opening of the container body for the door and the container body to be lock-fastened to each other.

Abstract: A wafer container includes a container body, which comprises a plurality of sidewalls, a bottom, and a top to define a space for containing wafers, an opening being formed on one sidewall, and a door with an outer surface and an inner surface. The top of the container body is disposed with a robotic flange which comprises a foolproof structure and a hemi-circular snap-hook portion that are disposed at the center and its circumference of a lower surface of the robotic flange facing the top. The foolproof structure has a geometric hole for a protruding portion on the top of the container body to be plugged in. After the protruding portion is plugged into the geometric hole, the robotic flange is further rotated along the container body about 180 degrees for the hemi-circular snap-hook portion to be engaged in a hemi-circular supporting portion on the top of the container body.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which, and a door, which is joined with opening of the container body for protecting the plurality of wafers in the container body, the characteristic in that: a magnetic member is formed at the inner edge of the opening of the container body and a magnet is disposed at the inner surface of the door corresponding to the magnetic member, the magnet being disposed in a magnetic yoke with recessed cross section, with the design of which the magnet on the door attracts the magnetic member at the opening of the container body for the door and the container body to be lock-fastened to each other.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting said plurality of wafers, and a door with an outer surface and an inner surface, which is joined with opening of the container body with its inner surface for protecting the plurality of wafers within the container, the characteristic in that: a plurality of pairs of rollers are disposed on the inner rim of the opening of container body.

Abstract: A wafer container includes a container body, composed of a pair of side walls, a top surface, and a bottom surface, on one sidewall of which is formed with an opening and on the other sidewall opposite to the opening is formed with a back wall, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: an inflatable supporting module is respectively disposed between each side wall of the container body and the back wall, a long slot is further disposed on the side of inflatable supporting module facing the opening, and an air inlet is further disposed on one end of the inflatable supporting module for being connected to an gas valve, wherein the inflatable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.

Abstract: A wafer container includes a container body that having an open front on sidewall, a plurality of slots disposed in the container body for support wafers, and a door is assembled with opening of the container body for protecting the wafer therein, the characteristic in that: at least one latch is disposed in the door and an inflatable seal element is located at the rim of the inner side of the door.