Patents by Inventor Kuo-Chun Tseng

Kuo-Chun Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130328067
    Abstract: An LED module includes a silicone substrate, an LED grain mounted on a face of the silicone substrate, a temperature sensor formed under the LED grain, a luminous sensor formed close to the LED grain and an encapsulation gel enclosing the LED grain, wherein the LED grain, the luminous sensor and the temperature sensor are electrically connected to electrodes for connection to foreign devices.
    Type: Application
    Filed: September 20, 2012
    Publication date: December 12, 2013
    Applicant: Feng Chia University
    Inventors: Ching-fu TSOU, Cheng-Han Huang, Kuo-Chun Tseng, Sheng-Wei Chang