Patents by Inventor Kuo-Chun Tseng

Kuo-Chun Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE
    Publication number: 20240134155
    Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Yu-Tai TSENG, Yu-Chun KE, Kuo-Jui WANG, Tzu-Chieh KUO
  • SEMICONDUCTOR DEVICE
    Publication number: 20240120405
    Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Heng-Ching Lin, Yu-Teng Tseng, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin
  • LED MODULE
    Publication number: 20130328067
    Abstract: An LED module includes a silicone substrate, an LED grain mounted on a face of the silicone substrate, a temperature sensor formed under the LED grain, a luminous sensor formed close to the LED grain and an encapsulation gel enclosing the LED grain, wherein the LED grain, the luminous sensor and the temperature sensor are electrically connected to electrodes for connection to foreign devices.
    Type: Application
    Filed: September 20, 2012
    Publication date: December 12, 2013
    Applicant: Feng Chia University
    Inventors: Ching-fu TSOU, Cheng-Han Huang, Kuo-Chun Tseng, Sheng-Wei Chang