Abstract: A light driving device comprises a signal generator, a demultiplexer and a light driving circuit. The signal generator generates a signal. The demultiplexer converts the signal to at least a control signal. The light driving circuit is controlled by the control signal.

Abstract: An embodiment of the invention is a microcavity plasma device that can be controlled by a low voltage electron emitter. The microcavity plasma device includes driving electrodes disposed proximate to a microcavity and arranged to contribute to generation of plasma in the microcavity upon application of a driving voltage. An electron emitter is arranged to emit electrons into the microcavity upon application of a control voltage. The electron emitter is an electron source having an insulator layer defining a tunneling region. The microplasma itself can serve as a second electrode necessary to energize the electron emitter. While a voltage comparable to previous microcavity plasma devices is still imposed across the microcavity plasma devices, control of the devices can be accomplished at high speeds and with a small voltage, e.g., about 5V to 30V in preferred embodiments.

Abstract: An ultra-thin miniature pump applied to transport a fluid includes a main body, a rotor, and a stator. The main body includes a cover part and a bottom part. A joint surface between the cover part and the bottom part possesses an anti-leakage device, and a chamber including a suction port and a discharge port is formed inside the main body. The rotor disposed in the chamber includes a magnet set, an impeller, and a central shaft. The magnet set is connected on the surface of the impeller, and the impeller with the magnet set is aligned by the central shaft and rotates in coaxial. The stator disposed in the chamber includes a plurality of coils corresponding to the magnet set axially. The coils and the magnet set generate an axial magnetic flux to make the impeller rotate for transporting the fluid from the suction port to the discharge port.

Abstract: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric on a first conducting layer. A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time-varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.

Abstract: A method for fabricating microcavity discharge devices and arrays of devices. The devices are fabricated by layering a dielectric on a first conducting layer. A second conducting layer or structure is overlaid on the dielectric layer. In some devices, a microcavity is created that penetrates the second conducting layer or structure and the dielectric layer. In other devices, the microcavity penetrates to the first conducting layer. The second conducting layer or structure together with the inside face of the microcavity is overlaid with a second dielectric layer. The microcavities are then filled with a discharge gas. When a time-varying potential of the appropriate magnitude is applied between the conductors, a microplasma discharge is generated in the microcavity. These devices can exhibit extended lifetimes since the conductors are encapsulated, shielding the conductors from degradation due to exposure to the plasma. Some of the devices are flexible and the dielectric can be chosen to act as a mirror.

Abstract: A light driving device comprises a signal generator, a demultiplexer and a light driving circuit. The signal generator generates a signal. The demultiplexer converts the signal to at least a control signal. The light driving circuit is controlled by the control signal.

Abstract: The present invention describes a flashing light apparatus and method for operating the same. A pulse signal generated by a pulse signal generator and the states of the general purpose Input/Output pins of a CPU are used to control the lights to flash.

Abstract: A burn-in socket for burn-in test is disclosed to include a body holding a set of terminals, and a shell detachably fastened to the body with locating pins that are detachably mounted in respective mounting through holes in the shell and inserted into respective mounting holes in the body for holding a test sample (electronic element) in contact with the terminals.

Abstract: A combination of burn-in socket and adapter board includes a burn-in socket and an adapter board for connecting the burn-in socket to a test apparatus, the burn-in socket having a body, a shell accommodating the body and defining a receiving hole for receiving a test sample (electronic element) for test, and terminals installed in the body, each terminal having a contact portion suspending in the receiving hole of the shell for the contact of the inserted test sample (electronic element) and a mounting portion extended out of the bottom side of the body and connected to a respective contact at the adapter board.

Abstract: The present invention describes a flashing light apparatus and method for operating the same. A pulse signal generated by a pulse signal generator and the states of the general purpose Input/Output pins of a CPU are used to control the lights to flash.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.