Abstract: An exemplary method for forming phosphor coating includes: providing a substrate; forming a first hydrophilic film on the substrate, the first film being soluble in water; forming a second lipophilic film on the first film, the second film comprised of a phosphor material; submerging the substrate having the first film and the second film formed thereon into water, so that the first film is dissolved in water and the second film is floated on surface of the water; and dipping a light source into the second film to forming a phosphor coating on the light source.

Abstract: An exemplary portable solar power generator includes a hollow light pervious housing, a light guide element, a condensing lens, a solar cell unit, and a connector assembly. The housing has a first refractive index, and sunlight enters the housing by passing through an outer surface thereof. The light guide element is positioned in and attached to the housing, which has a second refractive index larger than the first refractive index. The condensing lens is positioned in the housing, which is configured for converging the light incident thereon. The solar cell unit is positioned in the light pervious housing and located at a side of the condensing lens opposite to the light guide element. The solar cell unit is configured for receiving the light converged by the condensing lens and converting the received sunlight into electrical energy. The connector assembly is electrically coupled to the solar cell unit.

Abstract: An exemplary light emitting diode includes a substrate, a metal material and a light emitting diode chip. The substrate has a first surface and a first through hole defined in the first surface. The first through hole is filled with the metal material. The light emitting diode chip is mounted on the first surface contacting the metal material in the first through hole.

Abstract: An exemplary illuminating device includes a circuit board, a plurality of light sources, a thermal interface material, and a plurality of stretched resilient elements. The circuit board has a first surface and a second surface at an opposite side of the circuit board to the first surface. The plurality of light sources is electrically mounted on the first surface of the circuit board. The heat dissipating device is attached on the second surface of the circuit board. The thermal interface material is applied between the second surface of the circuit board and the heat dissipating device. The plurality of resilient elements are configured for connecting the circuit board with the heat dissipating device and providing a pulling force therebetween.