Abstract: An embodiment includes a method including forming a first interconnect structure over a first substrate, the first interconnect structure including dielectric layers and metallization patterns therein. The method also includes forming a redistribution via and a redistribution pad over the first interconnect structure, the redistribution via and the redistribution pad being electrically coupled to at least one of the metallization patterns of the first interconnect structure, the redistribution via and the redistribution pad having a same material composition. The method also includes forming a warpage control dielectric layer over the redistribution pad. The method also includes forming a bond via and a bond pad over the redistribution pad, the bond pad being in the warpage control dielectric layer, the bond via being electrically coupled to the redistribution pad.

Abstract: A method includes forming a function circuit on a semiconductor substrate of a device die, wherein the function circuit is in a functional circuit zone of the device die, forming a passive device over the semiconductor substrate, wherein the passive device is in a passive device zone of the device die, forming a first plurality of bond pads in the functional circuit zone and at a surface of the device die, wherein the first plurality of bond pads have a first pattern density; and forming a second plurality of bond pads in the passive device zone and at the surface of the device die. The second plurality of bond pads have a second pattern density lower than the first pattern density.

Abstract: In an embodiment, a device includes: a lower integrated circuit die; an upper integrated circuit die bonded to the lower integrated circuit die with a dielectric-to-dielectric bonding region and with a metal-to-metal bonding region; a first buffer layer around the upper integrated circuit die, the first buffer layer including a buffer material having a first thermal conductivity, the buffer material having a columnar crystalline structure, the columnar crystalline structure including crystalline columns having a substantially uniform orientation in a direction that extends away from the lower integrated circuit die; and a gap-fill dielectric over the first buffer layer and around the upper integrated circuit die, the gap-fill dielectric having a second thermal conductivity, the first thermal conductivity greater than the second thermal conductivity.

Abstract: A semiconductor device includes a first die, a second die and a third die. The first die has a first side including a plurality of first connecting structures and a second side including a plurality of second connecting structures, where the first side is opposite to the second side. The second die has a third side including a plurality of third connecting structures, where the plurality of third connecting structures are in contact with the plurality of first connecting structures of the first die. The third die has a fourth side including a plurality of fourth connecting structures, where the plurality of fourth connecting structures are in contact with the plurality of second connecting structures of the first die. A first pitch of the plurality of first connecting structures and a second pitch of the plurality of third connecting structures are less than a third pitch of the plurality of fourth connecting structures.

Abstract: A method includes bonding a bottom die to a carrier, and bonding a top die to the bottom die. The top die includes a semiconductor substrate, and the semiconductor substrate has a first thermal conductivity. The method further includes encapsulating the top die in a gap-fill region, bonding a supporting substrate to the top die and the gap-fill region to form a reconstructed wafer, wherein the supporting substrate has a second thermal conductivity higher than the first thermal conductivity, de-bonding the reconstructed wafer from the carrier, and forming electrical connectors on the bottom die.

Abstract: An apparatus for overturning and positioning a cassette is disclosed in the present invention so as to overturn a cassette and position the cassette after overturn. The apparatus for overturning and positioning a cassette comprises a overturning unit mounted on one side of the cassette to overturn the cassette, and at least one movable positioning unit including a base, a positioning member and a rolling member, the movable positioning unit being mounted on one side of the cassette being overturned. The positioning member and the rolling member are mounted on the base. The rolling member projects between the positioning member and the cassette so as to position the overturned cassette in a vertical direction while the positioning member positions the overturned cassette in a horizontal direction.