Patents by Inventor Kuo-Feng Tseng

Kuo-Feng Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9286970
    Abstract: A memory includes a word line, a bit line and a complementary bit line. A memory cell has a data node coupled to the bit line and a complementary data node coupled to the complementary bit line. The word line controls access to the memory cell. A circuit is coupled to the bit line and the complementary bit line. The circuit is configured to pull up to a high voltage, pull down to a low voltage, or float the bit line and the complementary bit line based on a first timing of pre-charging and a second timing of write driving. The first timing and the second timing are synchronized.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: March 15, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Zhang Kuo, Cheng-Chung Lin, Ho-Chieh Hsieh, Kuo Feng Tseng, Sang Hoo Dhong
  • Publication number: 20160012881
    Abstract: A memory includes a word line, a bit line and a complementary bit line. A memory cell has a data node coupled to the bit line and a complementary data node coupled to the complementary bit line. The word line controls access to the memory cell. A circuit is coupled to the bit line and the complementary bit line. The circuit is configured to pull up to a high voltage, pull down to a low voltage, or float the bit line and the complementary bit line based on a first timing of pre-charging and a second timing of write driving. The first timing and the second timing are synchronized.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 14, 2016
    Inventors: Ming-Zhang Kuo, Cheng-Chung Lin, Ho-Chieh Hsieh, Kuo Feng Tseng, Sang Hoo Dhong
  • Publication number: 20150286760
    Abstract: One or more systems and methods for scan cell assignment for a design layout of a semiconductor arrangement are provided. The design layout is evaluated to identify a set of sequential cells, such as flip flops connected to circuitry by data paths. Sequential cells within the set of sequential cells are assigned to either a scan cell assignment or a non-scan cell assignment based upon a control path criterion, a register bank criterion, a pipeline depth criterion, a sequential loop criterion, or other criteria to create a cell assignment list. Scan paths are connected to sequential cells assigned to the scan cell assignment so that test patterns can be sent to and received from such sequential cells during testing of the semiconductor arrangement for defects. Power, performance, and area utilization are improved because at least some sequential cells are assigned to the non-scan cell assignment.
    Type: Application
    Filed: April 3, 2014
    Publication date: October 8, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Cheng-Chung Lin, Ming-Zhang Kuo, Sang Hoo Dhong, Ho-Chieh Hsieh, Kuo Feng Tseng
  • Patent number: 8919427
    Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: December 30, 2014
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Cheng-Tu Wang, Pang-Hung Liao, Kuo-Feng Tseng, Wen-Tsai Chang
  • Patent number: 8389560
    Abstract: This invention relates to macrocyclic compounds of formula (I) shown in the specification. These compounds can be used to treat hepatitis C virus infection.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: March 5, 2013
    Assignee: TaiGen Biotechnology Co., Ltd.
    Inventors: Chen-Fu Liu, Kuang-Yuan Lee, Pei-Chin Cheng, Yo-Chin Liu, Pin Lo, Kuo-Feng Tseng, Chih-Ming Chen, Chi-Hsin Richard King, Chu-Chung Lin
  • Publication number: 20110065737
    Abstract: This invention relates to macrocyclic compounds of formula (I) shown in the specification. These compounds can be used to treat hepatitis C virus infection.
    Type: Application
    Filed: September 15, 2009
    Publication date: March 17, 2011
    Applicant: TaiGen Biotechnology Co., Ltd.
    Inventors: Chen-Fu Liu, Kuang-Yuan Lee, Pei-Chin Cheng, Yo-Chin Liu, Pin Lo, Kuo-Feng Tseng, Chih-Ming Chen, Chi-Hsin Richard King, Chu-Chung Lin
  • Publication number: 20090308576
    Abstract: A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.
    Type: Application
    Filed: June 17, 2008
    Publication date: December 17, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng, Chuan-Yu Lee
  • Publication number: 20090260793
    Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicated with the vapor channel are formed in the chamber. The heat-absorption part is formed on the metal tube and corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and the liquid channel of the heat-absorption part. The working fluid is filled in the chamber.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Tsai CHANG
  • Publication number: 20090260790
    Abstract: In metal tubes for heat pipes and a method of manufacturing the metal tubes, a metal tube includes a tube defining an inner space, and at least one dividing portion extruding from an inner sidewall of the metal tube. The at least one dividing portion divides the inner space into a vapor channel and a liquid channel connected to the vapor channel. The metal tubes can prevent heat pipe form being dried out and improve heat dissipation efficiency of heat pipes.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG
  • Publication number: 20090095460
    Abstract: A capillary structure includes a bare core shown as a long rod shape; and a capillary layer wound around the bare core and covered a surrounding thereof. The capillary layer is constructed by strands that are woven in a plurality of directions (i.e. curly interwoven) and continuously wound around an outer surrounding of the bare core. In the meantime, each woven strands is a strand bundled from a weaving material.
    Type: Application
    Filed: October 11, 2007
    Publication date: April 16, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng