Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.

Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.