Patents by Inventor Kuo-Fu Chien

Kuo-Fu Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultra-high vacuum (UHV) wafer processing
    Patent number: 9281221
    Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: March 8, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai
  • ULTRA-HIGH VACUUM (UHV) WAFER PROCESSING
    Publication number: 20140140792
    Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chung-En Kao, Tien-Chen Hu, Mao-Lin Kao, Kuo-Fu Chien, Keith Koai