Patents by Inventor Kuo-Fu Lin

Kuo-Fu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984379
    Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: May 14, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Patent number: 6819056
    Abstract: A color-changing bulb for an instrument panel of a vehicle, which is made as a bulb and directly installable in a bulb seat of the instrument panel is provided. The color-changing bulb includes a bulb housing defining a receiving space for receiving a light emitting diode and a circuit board. The light emitting diode includes three-color LED chips for generating red, green and blue light components. A controlling circuit is disposed on the circuit board and connected with the light emitting diode for driving the three-color LED chips to emit light. By use of a brightness adjustment switch on the instrument panel or the headlight switch, at least seven combinations of colors of light can be variably emitted to provide illuminating effect.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: November 16, 2004
    Assignee: Yeoujyi Electronics Co., Ltd.
    Inventor: Kuo-Fu Lin
  • Publication number: 20040207334
    Abstract: A color-changing bulb for an instrument panel of a vehicle, which is made as a bulb and directly installable in a bulb seat of the instrument panel is provided. The color-changing bulb includes a bulb housing defining a receiving space for receiving a light emitting diode and a circuit board. The light emitting diode includes three-color LED chips for generating red, green and blue light components. A controlling circuit is disposed on the circuit board and connected with the light emitting diode for driving the three-color LED chips to emit light. By use of a brightness adjustment switch on the instrument panel or the headlight switch, at least seven combinations of colors of light can be variably emitted to provide illuminating effect.
    Type: Application
    Filed: April 15, 2003
    Publication date: October 21, 2004
    Inventor: Kuo-Fu Lin