Patents by Inventor Kuo H. Lee

Kuo H. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits having improved fusible links
    Patent number: 5025300
    Abstract: An integrated circuit includes a conductive fusible link (14) that may be blown by laser energy. The dielectric material (15) covering the fuse is etched away to expose the fuse. A protective dielectric layer (30) is formed on the fuse to a controlled thickness less than that of the interlevel dielectric. The resulting structure prevents shorts between conductors that might otherwise occur due to debris from the fuse-blowing operation, and provides protection to the integrated circuit. In addition, the fuse blowing operation is more consistent from fuse to fuse.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: June 18, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: James N. Billig, James D. Chlipala, Kuo H. Lee, William J. Nagy