Abstract: An integrated circuit includes a transistor having a plurality of stacked channels each extending between the source/drain regions of the transistor. The transistor also includes a hard mask nanostructure above the highest channel and extending between the source/drain regions of the transistor. A gate dielectric and gate metals wrap around the channels and the hard mask nanostructure.

Abstract: A device includes a substrate, and a first semiconductor channel over the substrate. The first semiconductor channel includes a first nanosheet of a first semiconductor material, a second nanosheet of a second semiconductor material in physical contact with a topside surface of the first nanosheet, and a third nanosheet of the second semiconductor material in physical contact with an underside surface of the first nanosheet. The first gate structure is over and laterally surrounding the first semiconductor channel, and in physical contact with the second nanosheet and the third nanosheet.

Abstract: Multi-gate devices and methods for fabricating such are disclosed herein. An exemplary method includes forming a gate dielectric layer around first channel layers in a p-type gate region and around second channel layers in an n-type gate region. Sacrificial features are formed between the second channel layers in the n-type gate region. A p-type work function layer is formed over the gate dielectric layer in the p-type gate region and the n-type gate region. After removing the p-type work function layer from the n-type gate region, the sacrificial features are removed from between the second channel layers in the n-type gate region. An n-type work function layer is formed over the gate dielectric layer in the n-type gate region. A metal fill layer is formed over the p-type work function layer in the p-type gate region and the n-type work function layer in the n-type gate region.

Abstract: A device includes a substrate, and a first semiconductor channel over the substrate. The first semiconductor channel includes a first nanosheet of a first semiconductor material, a second nanosheet of a second semiconductor material in physical contact with a topside surface of the first nanosheet, and a third nanosheet of the second semiconductor material in physical contact with an underside surface of the first nanosheet. The first gate structure is over and laterally surrounding the first semiconductor channel, and in physical contact with the second nanosheet and the third nanosheet.

Abstract: A structure has stacks of semiconductor layers over a substrate and adjacent a dielectric feature. A gate dielectric is formed wrapping around each layer and the dielectric feature. A first layer of first gate electrode material is deposited over the gate dielectric and the dielectric feature. The first layer on the dielectric feature is recessed to a first height below a top surface of the dielectric feature. A second layer of the first gate electrode material is deposited over the first layer. The first gate electrode material in a first region of the substrate is removed to expose a portion of the gate dielectric in the first region, while the first gate electrode material in a second region of the substrate is preserved. A second gate electrode material is deposited over the exposed portion of the gate dielectric and over a remaining portion of the first gate electrode material.

Abstract: A video synchronous playback system and a method and a terminal device for video synchronous playback are provided. The method includes: outputting a video by a first communication interface, wherein the video has a first playback configuration; in response to at least one of receiving a control command generated by a first playback configuration control area being operated and an expiration of a counter, outputting a first playback signal corresponding to the first playback configuration through the first communication interface by a first processor; and receiving the first playback signal and outputting the video by a second terminal device.

Abstract: An erasing method for a non-volatile memory is provided. The method includes the following two major steps. (a) A first voltage is applied to the odd-numbered select gates of each memory row and a second voltage is applied to the even-numbered select gates of each memory row such that the voltage difference between the first voltage and the second voltage is large enough for the electrons injected into the floating gate of the memory cells to be removed via the select gate. (b) A switchover operation is performed so that the first voltage is applied to the even-numbered select gates of each memory row and the second voltage is applied to the odd-numbered select gates of each memory row such that the electrons injected into the floating gates of the memory cells are pulled away via the select gates to turn the memory cells into an erased state.

Abstract: An erasing method for a non-volatile memory is provided. The method includes the following two major steps. (a) A first voltage is applied to the odd-numbered select gates of each memory row and a second voltage is applied to the even-numbered select gates of each memory row such that the voltage difference between the first voltage and the second voltage is large enough for the electrons injected into the floating gate of the memory cells to be removed via the select gate. (b) A switchover operation is performed so that the first voltage is applied to the even-numbered select gates of each memory row and the second voltage is applied to the odd-numbered select gates of each memory row such that the electrons injected into the floating gates of the memory cells are pulled away via the select gates to turn the memory cells into an erased state.