Abstract: A wafer cleaning apparatus includes a chamber, a rotary chuck, a liquid spray post, a top lid, a liquid conveying pipeline, a protection pipeline, and a leak sensor. The rotary chuck is located in the chamber, and is configured to attach a wafer cassette. The liquid spray post is located in the chamber. The liquid spray post faces the wafer cassette. The top lid is located on the chamber. The liquid spray post is disposed on the bottom surface of the top lid. The liquid conveying pipeline is located outside the chamber and communicates the liquid spray post, and is disposed along a bottom surface and an external sidewall of the top lid. The protection pipeline sleeves on the liquid conveying pipeline. The leak sensor is located in the protection pipeline, and is located under the lowest section of the liquid conveying pipeline.

Abstract: An image-capturing assembly includes a circuit board, an optical filter, an image-capturing element between the circuit board and the optical filter, and a holder. The holder includes a fixing portion. The image-capturing element is on the circuit board and electrically connected to the circuit board. The holder is on an external side of the image-capturing element. The fixing portion has an upper surface and a lower surface opposite to each other, and the lower surface is fixed on the circuit board. The optical filter is fixed on the upper surface of the fixing portion.

Abstract: A camera assembly and a mobile device having the same are provided. The camera assembly includes a housing and a lens assembly. The housing has an opening, and the lens assembly is disposed in the housing. The lens assembly includes a first lens and a second lens. The first lens is disposed adjacent to the opening and the first lens has a top lens portion. The top lens portion protrudes out of the opening. The second lens is disposed on a side of the first lens opposite to the top lens portion.

Abstract: An image-capturing assembly includes a circuit board, an optical filter, an image-capturing element between the circuit board and the optical filter, and a holder. The holder includes a fixing portion. The image-capturing element is on the circuit board and electrically connected to the circuit board. The holder is on an external side of the image-capturing element. The fixing portion has an upper surface and a lower surface opposite to each other, and the lower surface is fixed on the circuit board. The optical filter is fixed on the upper surface of the fixing portion.

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract: An image capturing module having a built-in flexible dustproof structure includes an image sensing unit, a housing frame, an actuator structure and a flexible ring. The image sensing unit includes a carrier substrate and an image sensing chip. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure is disposed on the housing frame. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The flexible ring is disposed around an outer perimeter surface of the movable lens assembly and abutted against an inner surrounding surface of the lens holder. Whereby, the flexible ring is surroundingly disposed between the inner surrounding surface of the lens holder and the outer perimeter surface of the movable lens assembly to form the built-in flexible dustproof structure.

Abstract: An image capturing module having a built-in topmost dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip on the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The lens holder has a first topmost surrounding structure disposed on the inner surrounding surface and the topmost side thereof. The movable lens assembly has a second topmost surrounding structure disposed on the outer perimeter surface and the topmost side thereof and above the first topmost surrounding structure. The first topmost surrounding structure and the second topmost surrounding structure are mated with each other to form the built-in topmost dustproof structure.