Abstract: An electrical connection assembly includes two electrical connectors and a bridge connector. Each of the two electrical connectors includes plural terminals and an insulation housing that accommodates the terminals. The bridge connector is located between the two electrical connectors. The bridge connector includes an insulation body, a conductive plastic, plural signal terminals, and plural ground terminals. The conductive plastic is covered by the insulation body. The ground terminals and the signal terminals of the bridge connector are arranged at intervals. The ground terminals of the bridge connector are in electrical contact with the conductive plastic. When two opposite sides of the insulation body are respectively coupled to the two electrical connectors so as to be surrounded by the two electrical connectors, the ground terminals of the bridge connector are respectively in electrical contact with the ground terminals of the two electrical connectors.

Abstract: A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, a magnetic tunneling junction (MTJ) on the MTJ region and a first metal interconnection on the MTJ. Preferably, a top view of the MTJ includes a circle and a top view of the first metal interconnection includes an ellipse overlapping the circle.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has a tongue portion. The signal terminals are located in the insulation body. The ground terminals are located in the insulation body, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on the tongue portion of the insulation body and is disposed along the tongue portion. When the tongue portion of the insulation body is coupled to the butt plug so as to be surrounded by the butt plug, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has an accommodating recess. The signal terminals are located in the accommodating recess. The ground terminals are located in the accommodating recess, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on a top surface of the insulation body facing the butt plug. When the butt plug is inserted into the accommodating recess of the insulation body, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate. A semiconductor strip is between the isolation regions. The method further includes recessing the isolation regions so that a top portion of the semiconductor strip protrudes higher than top surfaces of the isolation regions to form a semiconductor fin, measuring a fin width of the semiconductor fin, generating an etch recipe based on the fin width, and performing a thinning process on the semiconductor fin using the etching recipe.

Abstract: In an embodiment a system includes: a wafer store comprising a wafer configured for processing by a semiconductor processing tool; a cart configured to transport the wafer from the wafer store along a predetermined path; a robotic arm, the robotic arm configured to: read wafer data from the wafer store, transport the wafer from the wafer store to the cart, send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may inject material into a mold for a housing of an information handling system through at least one cavity for at least one pivot and through multiple positions adjacent to a clickpad cavity to create a clickpad portion of the housing; may create multiple bridges at multiple positions that bind the clickpad portion of the housing to other portions of the housing; and may remove the multiple bridges to permit the clickpad portion of the housing to rotate about the at least one pivot. For example, the housing of the information handling system, the at least one pivot, and the clickpad holder may be formed of a unitary material. For instance, the unitary material may be or include a polymer.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may inject material into a mold for a housing of an information handling system through at least one cavity for at least one pivot and through multiple positions adjacent to a clickpad cavity to create a clickpad portion of the housing; may create multiple bridges at multiple positions that bind the clickpad portion of the housing to other portions of the housing; and may remove the multiple bridges to permit the clickpad portion of the housing to rotate about the at least one pivot. For example, the housing of the information handling system, the at least one pivot, and the clickpad holder may be formed of a unitary material. For instance, the unitary material may be or include a polymer.

Abstract: In an embodiment a system includes: a wafer store comprising a wafer configured for processing by a semiconductor processing tool; a cart configured to transport the wafer from the wafer store along a predetermined path; a robotic arm, the robotic arm configured to: read wafer data from the wafer store, transport the wafer from the wafer store to the cart, send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.

Abstract: An information handling system can include a base, a printed circuit board including a capacitive switch, and a cover. The printed circuit board can be attached to the base, and the cover can lie adjacent to the printed circuit board. The capacitive switch can be configured to change state when an object is close to the cover. The cover can be configured such that it can be detached from the remainder of the information handling system while the printed circuit board remains attached to the base. The configuration of the printed circuit board and cover can be particularly useful when maintaining a keyboard or a touch pad or when replacing the cover.