Abstract: A transfer system for wafer cassettes includes a tray and a rail compatible with the tray. The tray includes a base plate, a through hole, a wall, and a pair of first positioning features. The through hole is disposed on a center of the base plate, in which the through hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from a surface of the base plate and surrounding the through hole, in which the wall separates the base plate into an interior region and an exterior region. The pair of first positioning features having a first level height are in the interior region and arranged parallel to the first direction axis.

Abstract: A cleaning device is provided, including a top portion, a middle portion, and a bottom portion. The top portion includes a first opening. The middle portion is connected to the top portion, and includes an inlet on a lateral side, an annular channel communicated with the inlet, and a second opening communicated with the first opening. The bottom portion is connected to the middle portion, and includes a reservoir and a third opening. The third opening communicates the second opening and the reservoir.

Abstract: A cleaning device is provided, including a top portion, a middle portion, and a bottom portion. The top portion includes a first opening. The middle portion is connected to the top portion, and includes an inlet on a lateral side, an annular channel communicated with the inlet, and a second opening communicated with the first opening. The bottom portion is connected to the middle portion, and includes a reservoir and a third opening. The third opening communicates the second opening and the reservoir.

Abstract: A spray coating system is provided. The spray coating system includes a spin support for supporting and spinning the substrate; a sprayer for applying a material to an upper surface of the substrate; a cup surrounding a lateral and lower region of the spin support, wherein an opening is located in an upper central region of the cup; an air supply mechanism for supplying air flows to a back surface of the substrate to prevent the material from adhering thereto, and an exhaust zone disposed below a slanted surface of the cup for exhausting the air flow and material.

Abstract: A method for leveling a wafer in a photolithography apparatus is disclosed, including inputting a wafer into the photolithography apparatus to be supported by a chuck, using at least three image capture devices to capture images of corresponding alignment marks on the wafer; and leveling the wafer according to the clarity of the images of the corresponding alignment marks on the wafer captured by the image capture device.

Abstract: A scanning electron microscope is provided. The scanning electron microscope includes an electron beam source generating a primary electron beam, a condenser lens converging the primary electron beam, a base plate with a diamond film formed on the surface thereof having an aperture for passing of the primary electron beam, and a scanning unit two-dimensionally scanning a specimen with the primary electron beam.

Abstract: A wafer cassette. At least one support bar includes a composite curved holding portion. Multiple separation plates are connected to the composite curved holding portion and are parallel to and separated from each other.

Abstract: A scanning electron microscope is provided. The scanning electron microscope includes an electron beam source generating a primary electron beam, a condenser lens converging the primary electron beam, a base plate with a diamond film formed on the surface thereof having an aperture for passing of the primary electron beam, and a scanning unit two-dimensionally scanning a specimen with the primary electron beam.

Abstract: A calibration cassette pod for robot teaching and a method of using the calibration cassette pod are described. In the calibration cassette pod, a cassette pod body and a cassette pod door are first provided wherein the cassette pod body is constructed of a top panel, a bottom panel, two side panels and a front panel to enclose a cavity therein. A first plurality of ribs is formed on an inside surface of the cassette pod body, each having a predetermined depth sufficient to support an edge portion of a wafer. An optical detector housing is mounted on an opening in the front panel and is adapted for receiving an optical detector therein. An optical detector that includes a light emission source and a photo diode receiver for determining the position of the edge portion of the wafer is mounted in the optical detector housing.

Abstract: A calibration cassette pod for robot teaching and a method of using the calibration cassette pod are described. In the calibration cassette pod, a cassette pod body and a cassette pod door are first provided wherein the cassette pod body is constructed of a top panel, a bottom panel, two side panels and a front panel to enclose a cavity therein. A first plurality of ribs is formed on an inside surface of the cassette pod body, each having a predetermined depth sufficient to support an edge portion of a wafer. An optical detector housing is mounted on an opening in the front panel and is adapted for receiving an optical detector therein. An optical detector that includes a light emission source and a photo diode receiver for determining the position of the edge portion of the wafer is mounted in the optical detector housing.

Abstract: A calibration cassette pod for robot teaching and a method of using the calibration cassette pod are described. In the calibration cassette pod, a cassette pod body and a cassette pod door are first provided wherein the cassette pod body is constructed of a top panel, a bottom panel, two side panels and a front panel to enclose a cavity therein. A first plurality of ribs is formed on an inside surface of the cassette pod body, each having a predetermined depth sufficient to support an edge portion of a wafer. An optical detector housing is mounted on an opening in the front panel and is adapted for receiving an optical detector therein. An optical detector that includes a light emission source and a photo diode receiver for determining the position of the edge portion of the wafer is mounted in the optical detector housing.

Abstract: A latch sensor for a pod transport gripper for transferring semiconductor wafers is disclosed. The transport gripper has a left bar and a right bar, as well as a cross bar connecting the left and the right bars. The gripper also has a left clamp and a right clamp disposed on interior sides of the left bar and the right bar, respectively, to clamp a pod, such as a front-opening unified pod (FOUP), for transport. A number of latches are disposed on the cross bar, and correspond to a number of latch holes of the pod. The gripper has at least one latch sensor disposed on either the left bar, the right bar, or both, to determine whether the latches have properly engaged the latch holes of the pod.

Abstract: A primer tank having a nozzle assembly which uniformly distributes nitrogen or other vapor-generating gas against a primer liquid in the tank to generate a primer vapor for the priming of a semiconductor wafer substrate. The nozzle assembly includes a conduit to which is confluently attached a nozzle head having a nozzle plate. Multiple openings are provided in the nozzle plate to substantially uniformly distribute nitrogen or other inert gas against the surface of the primer liquid over a large area to generate a primer mist from the primer liquid and substantially reduce the formation of primer droplets in the tank.

Abstract: A new and improved system for rinsing substrates. The substrate-rinsing system includes at least one rinsing unit having a nozzle that is angularly and linearly adjustable with respect to the substrate. A controller may be used to automatically control the angular and linear positions of the nozzle during the substrate-rinsing procedure in order to facilitate timely and effective rinsing or cleaning of the substrate.

Abstract: A latch sensor for a pod transport gripper for transferring semiconductor wafers is disclosed. The transport gripper has a left bar and a right bar, as well as a cross bar connecting the left and the right bars. The gripper also has a left clamp and a right clamp disposed on interior sides of the left bar and the right bar, respectively, to clamp a pod, such as a front-opening unified pod (FOUP), for transport. A number of latches are disposed on the cross bar, and correspond to a number of latch holes of the pod. The gripper has at least one latch sensor disposed on either the left bar, the right bar, or both, to determine whether the latches have properly engaged the latch holes of the pod.

Abstract: A calibration cassette pod for robot teaching and a method of using the calibration cassette pod are described. In the calibration cassette pod, a cassette pod body and a cassette pod door are first provided wherein the cassette pod body is constructed of a top panel, a bottom panel, two side panels and a front panel to enclose a cavity therein. A first plurality of ribs is formed on an inside surface of the cassette pod body, each having a predetermined depth sufficient to support an edge portion of a wafer. An optical detector housing is mounted on an opening in the front panel and is adapted for receiving an optical detector therein. An optical detector that includes a light emission source and a photo diode receiver for determining the position of the edge portion of the wafer is mounted in the optical detector housing.